DSA patterning options for FinFET formation at 7nm node

Chi-Chun Charlie Liu; Elliott Franke; Fee Li Lie; Stuart Sieg; Hsinyu Tsai; Kafai Lai; Hoa Truong; Richard Farrell; Mark Somervell; Daniel Sanders; Nelson Felix; Michael Guillorn; Sean Burns; David Hetzer; Akiteru Ko; John Arnold; Matthew Colburn

doi:10.1117/12.2219670

22 March 2016 DSA patterning options for FinFET formation at 7nm node

Chi-Chun Charlie Liu, Elliott Franke, Fee Li Lie, Stuart Sieg, Hsinyu Tsai, Kafai Lai, Hoa Truong, Richard Farrell, Mark Somervell, Daniel Sanders, Nelson Felix, Michael Guillorn, Sean Burns, David Hetzer, Akiteru Ko, John Arnold, Matthew Colburn

Author Affiliations +

Proceedings Volume 9777, Alternative Lithographic Technologies VIII; 97770R (2016) https://doi.org/10.1117/12.2219670
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

Several 27nm-pitch directed self-assembly (DSA) processes targeting fin formation for FinFET device fabrication are studied in a 300mm pilot line environment, including chemoepitaxy for a conventional Fin arrays, graphoepitaxy for a customization approach and a hybrid approach for self-aligned Fin cut. The trade-off between each DSA flow is discussed in terms of placement error, Fin CD/profile uniformity, and restricted design. Challenges in pattern transfer are observed and process optimization are discussed. Finally, silicon Fins with 100nm depth and on-target CD using different DSA options with either lithographic or self-aligned customization approach are demonstrated.

Citation Download Citation

Chi-Chun Charlie Liu, Elliott Franke, Fee Li Lie, Stuart Sieg, Hsinyu Tsai, Kafai Lai, Hoa Truong, Richard Farrell, Mark Somervell, Daniel Sanders, Nelson Felix, Michael Guillorn, Sean Burns, David Hetzer, Akiteru Ko, John Arnold, and Matthew Colburn "DSA patterning options for FinFET formation at 7nm node", Proc. SPIE 9777, Alternative Lithographic Technologies VIII, 97770R (22 March 2016); https://doi.org/10.1117/12.2219670

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