These image-and-design integration methodologies include contour extraction and alignment to design, contour-to-design defect detection, defective/nuisance pattern retrieval, confirmed defective/nuisance pattern overlay with inspection data, and modulation-related weak-pattern ranking. The technique we present provides greater automation, from defect detection to defective pattern retrieval to decision-making steps, that allows for statistically summarized results and increased coverage of the wafer to be achieved without an adverse impact on cycle time. Statistically summarized results, lead to objective assessments of the output; and increased coverage, in turn, leads to a more comprehensive assessment of the impact of each pattern defect and each focus/exposure modulation. Overall, this leads to a more accurate determination of the process window. |
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CITATIONS
Cited by 1 scholarly publication.
Inspection
Defect detection
Data analysis
Defect inspection
Lithography
Process control
Failure analysis