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20 May 2016 Indium-bump-free antimonide superlattice membrane detectors on a silicon substrates
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We present an approach to realize antimonide based superlattices on silicon substrates without using conventional Indium-bump hybridization. In this approach, PIN based superlattice detectors are grown on top of a 60 nm Al0.6Ga0.4Sb sacrificial layer on a GaSb host substrate. Following the growth, the individual pixels are transferred using our epitaxiallift off technique, which consists of a wet-etch to undercut the pixels followed by a dry-stamp process to transfer the pixels to a silicon substrate prepared with a gold layer. Structural and optical characterization of the transferred pixels was done using an optical microscope, scanning electron microscopy and photoluminescence. The interface between the transferred pixels and the new substrate was abrupt and no significant degradation in the optical quality was observed. An Indium-bump-free membrane detector was then fabricated using this approach. Spectral response measurements provided a 100% cut-off wavelength of 4.3 μm at 77 K. The performance of the membrane detector was compared to a control detector on the as-grown substrate. The membrane detector was limited by surface leakage current. The proposed approach could pave the way for wafer-level integration of photonic detectors on silicon substrates, which could dramatically reduce the cost of these detectors.
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M. Zamiri, B. Klein, T. Schuler, S. Myers, F. Cavallo, and S. Krishna "Indium-bump-free antimonide superlattice membrane detectors on a silicon substrates", Proc. SPIE 9819, Infrared Technology and Applications XLII, 98190W (20 May 2016);


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