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13 May 2016 Multiple wavelength silicon photonic 200 mm R+D platform for 25Gb/s and above applications
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A silicon photonics platform that uses a CMOS foundry line is described. Fabrication process is following a modular integration scheme which leads to a flexible platform, allowing different device combinations. A complete device library is demonstrated for 1310 nm applications with state of the art performances. A PDK which includes specific photonic features and which is compatible with commercial EDA tools has been developed allowing an MPW shuttle service. Finally platform evolutions such as device offer extension to 1550 nm or new process modules introduction are presented.
Conference Presentation
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. Szelag, B. Blampey, T. Ferrotti, V. Reboud, K. Hassan, S. Malhouitre, G. Grand, D. Fowler, S. Brision, T. Bria, G. Rabillé, P. Brianceau, J. M. Hartmann, V. Hugues, A. Myko, F. Elleboode, F. Gays, J. M. Fédéli, and C. Kopp "Multiple wavelength silicon photonic 200 mm R+D platform for 25Gb/s and above applications", Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98911C (13 May 2016);


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