Reticle qualification and re-qualification for EUV production today and in the future

Mingwei Li; Amo Chen; Vidyasagar Anantha; Ray Shi

doi:10.1117/12.2650339

11 November 2022 Reticle qualification and re-qualification for EUV production today and in the future

Mingwei Li, Amo Chen, Vidyasagar Anantha, Ray Shi

Author Affiliations +

Proceedings Volume PC12293, Photomask Technology 2022; PC122930F (2022) https://doi.org/10.1117/12.2650339
Event: SPIE Photomask Technology + EUV Lithography, 2022, Monterey, California, United States

Abstract

High-sensitivity EUV reticle inspections in mask shop and IC fab are required to enable successful EUV adoption in production for the considerations of yield increase, cost and cycle time reduction. Since 1st optical (193nm) tool for EUV reticles inspection was released in 2017, KLA has been committed to having continuous performance improvement both in hardware and die-to-database algorithms for EUV High Volume Manufacturing (HVM) reticle qualification. In this paper, we will provide an overview of the latest KLA activities toward enabling EUV-reticle manufacturing through 193-nm reticle-inspection tool advancements to meet requirements for mask shop qualification and for IC fab mask re-qualification. This is accomplished via combined inspection steps of direct reticle inspection and wafer print check. We will also review challenges for future nodes and show the latest progress to address them utilizing next-generation reticle inspection systems.

Conference Presentation

Citation Download Citation

Mingwei Li, Amo Chen, Vidyasagar Anantha, and Ray Shi "Reticle qualification and re-qualification for EUV production today and in the future", Proc. SPIE PC12293, Photomask Technology 2022, PC122930F (11 November 2022); https://doi.org/10.1117/12.2650339

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