PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
Ion shield plate equipped Microwave-ECR etcher was developed to enable reactive ion vertical etching and isotropic radical etching in one chamber. The radical etching of BCl3 could etch HfO2 (High-k) in the low-pressure region below 0.6 Pa. The addition of SiCl4 to BCl3 improved the selectivity to SiGe. For SiOC (Low-k), NF3/N2 gas chemistry can be used for highly selective etching to SiO2 and SiN. The radical etching of NF3/N2 has low carbon reduction than the reactive ion etching.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Yusuke Nakatani, Yasushi Sonoda, Taku Iwase, Yi Lin, Masashi Kawabata, Motohiro Tanaka, "Radical etching of high-k and low-k dielectrics for three-dimension device manufacturing with microwave-ECR etching system," Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC124990I (30 April 2023); https://doi.org/10.1117/12.2656040