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‘Systems of chips’ such as 3D ICs and HBMs are already being widely applied in industry sectors such as high-performance computing, mobile, and automotive. The design of such chips has required a ‘hyperconvergence’ of various design and multiphysics disciplines. To fabricate such chips efficiently, we are also beginning to see increased convergence of design, multiphysics, and manufacturing technologies. And AI technologies have proliferated widely in design and manufacturing solutions, helping accelerate the availability of AI platforms, setting up a virtuous cycle of AI helping AI.
In this talk, I will survey the state of the industry on these fronts and share some suggestions to accelerate this convergence.
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