Presentation
13 November 2024 Massive on-cell overlay metrology solution based on Mueller-matrix analysis for advanced process control
Author Affiliations +
Abstract
We have developed a massive on-cell overlay metrology system based on Mueller matrix measurements. By integrating microscopic techniques into ellipsometry, we achieved high-throughput and extensive sampling coverage, with 1-shot/field per 1-field of view (FOV) measurement capability within a 34 x 34 mm2 FOV. Analyzing the off-diagonal components of the Mueller matrix allowed for on-cell overlay measurement across the wafer. This system provides measurement sensitivity comparable to e-beam-based technologies while offering high coverage, enabling precise reticle correction or high-order overlay correction in photolithography processes. This advancement represents a significant improvement in overlay metrology, offering both sensitivity and resolution for enhanced semiconductor manufacturing processes.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Changhyeong Yoon, Hyukjoon Cho, Ji Yong Shin, Kihun Kang, Juntaek Oh, Donggun Lee, Jaehyun Son, Seunga Lim, Eunsoo Hwang, Jinsoo Lee, ByeongKi Kang, Jaewon Lee, Jinwoo Ahn, Taeyong Jo, Jungho Ahn, Jihye Lee, Seulki Kim, Kyunghoon Park, JangKyu Lee, Heedong Kwak, Younghoon Sohn, Yusin Yang, and Myungjun Lee "Massive on-cell overlay metrology solution based on Mueller-matrix analysis for advanced process control", Proc. SPIE PC13215, International Conference on Extreme Ultraviolet Lithography 2024, PC132150B (13 November 2024); https://doi.org/10.1117/12.3032695
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KEYWORDS
Overlay metrology

Advanced process control

Metrology

Ellipsometry

Imaging systems

Semiconductors

Scanning electron microscopy

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