High-performance C/B multilayer for beyond EUV lithography

Umi Fujimoto; Shinji Yamakawa; Tetsuo Harada

doi:10.1117/12.3034657

13 November 2024 High-performance C/B multilayer for beyond EUV lithography

Umi Fujimoto, Shinji Yamakawa, Tetsuo Harada

Author Affiliations +

Proceedings Volume PC13215, International Conference on Extreme Ultraviolet Lithography 2024; PC132150V (2024) https://doi.org/10.1117/12.3034657
Event: SPIE Photomask Technology + EUV Lithography, 2024, Monterey, California, United States

Conference Poster

Abstract

In the future, since semiconductor devices with higher-density electronic circuits are required, beyond EUV (BEUV) lithography technology with an exposure wavelength around 6.7nm is expected to utilize as the next generation lithography. La/B-based multilayers were reported as a high theoretical reflective multilayer. However, the stability of the reflectance of La/B-based multilayers would be low because of the high reactivity of La material. Thus, we proposed carbon/boron (C/B) multilayer for BEUV multilayer as a stable and highly reflective multilayer for BEUV Lithography. The optical constants of carbon films vary greatly with density. As the density of Carbon films increases, the reflectance of C/B multilayer improves, and the bandwidth becomes wider. In this study, we report the development of C/B multilayers with high density Carbon films.

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Umi Fujimoto, Shinji Yamakawa, and Tetsuo Harada "High-performance C/B multilayer for beyond EUV lithography", Proc. SPIE PC13215, International Conference on Extreme Ultraviolet Lithography 2024, PC132150V (13 November 2024); https://doi.org/10.1117/12.3034657

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