Journal of Micro/Nanolithography, MEMS, and MOEMS

Co-Editors-in-Chief: 
Harry Levinson, HJL Lithography, USA
Hans Zappe, University of Freiburg, Germany

The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM 3) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.

On the cover: The figure is from the paper " Cascade and cluster of correlated reactions as causes of stochastic defects in exrtreme ultraviolet lithography" by Hiroshi Fukuda, from Vol. 19, Issue 2.

Calls for Papers
How to Submit a Manuscript

Regular papers: Submissions of regular papers are always welcome.

Special section papers: Open calls for papers are listed below. A cover letter indicating that the submission is intended for a particular special section should be included with the paper.

To submit a paper, please prepare the manuscript according to the journal guidelines and use the online submission systemLeaving site. All papers will be peer‐reviewed in accordance with the journal's established policies and procedures. Authors who pay the voluntary page charges will receive the benefit of open access.

EUV Masks
Publication Date
Vol. 20, Issue 4
Submission Deadline
Submissions due 28 February 2021.
Guest Editors
Martin Burkhardt

IBM Research
Yorktown Heights, New York, USA
martburk@us.ibm.com

 

Vicky Philipsen

IMEC
Leuven, Belgium
vicky.philipsen@imec.be

Call for papers

After more than a decade in the research and development phase, extreme ultraviolet lithography (EUVL) is finally being used for manufacturing in the semiconductor industry.

To guarantee superior EUVL performance for current and future technology nodes, the mask community continues to further improve the photomask itself. The current state-of-the-art tantalum-based absorber has been a good starting point for early manufacturing but has also been shown to yield non-optimal imaging performance. For this reason, mask technology is still a very active area of research, where the mask materials and concepts are being challenged, engineered, examined, and matured to support next-generation lithography.

Both theoretical and experimental papers advancing the state of the art in simulation, material selection, blank and mask manufacturing, repair, inspection, and imaging are welcome in all aspects of EUV masks, including but not limited to:

  • Rigorous imaging simulations
  • Source mask optimization
  • Alternative absorber materials
  • Absorber patterning
  • Printing with novel absorber materials
  • Mask inspection and review
  • Mask repair
  • Lifetime and compatibility assessment  

All papers will undergo the standard peer-review process for the Journal of Micro/Nanopatterning, Materials, and Metrology (JM 3). Manuscripts should be submitted to SPIE according to the journal guidelines at http://spie.org/jm3. A cover letter indicating that the submission is intended for this special section should be included. For more information, please contact the guest editors or jm3@spie.org.

Papers are published as soon as they are accepted for publication and final proofs are approved. Early submission is encouraged.

EUV Masks
Published Special Sections

Control of Integrated Circuit Patterning Variance, Part 4: Placement and Critical Dimension, Edge to Edge Overlay (April-June 2019)
Guest Editor: Alexander Starikov

Challenges and Approaches to EUV-Based Patterning for High-Volume Manufacturing Applications (January-March 2019)
Guest Editors: Sebastian Engelmann, Rich Wise, Roel Gronheid, and Nelson Felix

Control of Integrated Circuit Patterning Variance, Part 3: Pattern Roughness, Local Uniformity, and Stochastic Defects (October-December 2018)
Guest Editors: John C. Robinson, Tim Brunner, Gian Lorusso

Novel Patterning Technologies (July-September 2018)
Guest Editors: Eric Panning and Martha Sanchez

EUV Lithography for the 3-nm Node and Beyond (October-December 2017)
Guest Editors: Vivek Bakshi, Hakaru Mizoguchi, Ted Liang, Andrew Grenville, and Jos Benschop

Alternative Lithographic Technologies V (July-September 2016)
Guest Editors: Chris Bencher and Ricardo Ruiz

Control of Integrated Circuit Patterning Variance, Part 2: Image Placement, Device Overlay, and Critical Dimension (April-June 2016)
Guest Editor: Alexander Starikov

Photomask Manufacturing Technology (April-June 2016)
Guest Editors: Masato Shibuya, Morihisa Hoga, and Kiwamu Takehisa

Extending VLSI and Alternative Technology with Optical and Complementary Lithography (April-June 2016)
Guest Editors: Kafai Lai and Andreas Erdmann

On the Interface of Holography and MEMS (October-December 2015)
Guest Editors: Partha Banerjee, Pierre-Alexandre Blanche, Christophe Moser, and Myung K. Kim

Alternative Lithographic Technologies IV (July-September 2015)
Guest Editors: Douglas J. Resnick, Ricardo Ruiz, and Hans Loeschner

Control of Integrated Circuit Patterning Variance Part 1: Metrology, Process Monitoring, and Control of Critical Dimension (April-June 2015)
Guest Editors: Alexander Starikov and Matthew Sendelbach

Continuation of Scaling with Optical and Complementary Lithography (January-March 2015)
Guest Editors: Kafai Lai and Andreas Erdmann

Holistic/Hybrid Metrology (October-December 2014)
Guest Editors: Alok Vaid and Eric Solecky

Alternative Lithographic Technologies III (July-September 2014)
Guest Editors: Douglas J. Resnick, Christopher Bencher, and Ricardo Ruiz

Metrology and Inspection for 3-D Integrated Circuits and Interconnects (January-March 2014)
Guest Editors: Yi-sha Ku and Alexander Starikov

Emerging MOEMS Technology and Applications (January-March 2014)
Guest Editors: M. Edward Motamedi, Joel Kubby, Patrick Ian Oden, and Wibool Piyawattanametha

Optical Lithography Extension Beyond the 14-nm Node (January-March 2014)
Guest Editors: Will Conley and Kafai Lai

Advanced Fabrication of MEMS and Photonic Devices (October-December 2013)
Guest Editors: Georg von Freymann, Mary Ann Maher, and Thomas J. Suleski

Advanced Plasma-Etch Technology (October-December 2013)
Guest Editors: Ying Zhang, Qinghuang Lin, and Gottlieb S. Oehrlein

Alternative Lithographic Technologies (July-September 2013)
Guest Editors: Will Tong and Douglas J. Resnick

Photomasks for EUV Lithography (April-June 2013)
Guest Editors: Christopher J. Progler and Frank E. Abboud

Alternative Lithographic Technologies (July-September 2012)
Guest Editors: William M. Tong, Douglas J. Resnick, and Benjamin Rathsack

Directed Self-Assembly (July-September 2012)
Guest Editors: Daniel P. Sanders and William H. Arnold

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS III (April-June 2012)
Guest Editors: Sonia M. García-Blanco and Rajeshuni Ramesham

EUV Sources for Lithography (April-June 2012)
Guest Editors: Vivek Bakshi and Anthony Yen

Dimensional Metrology with Atomic Force Microscopy: Instruments and Applications (January-March 2012)
Guest Editors: Ronald Dixson and Ndubuisi G. Orji

Theory and Practice of MEMS, NEMS, and MOEMS (January-March 2011)
Guest Editor: Yu-Cheng Lin

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II (October-December 2010)
Guest Editor: Rajeshuni Ramesham

Line-Edge Roughness (October-December 2010 )
Guest Editors: Chris A. Mack and Will Conley

Metrology (October-December 2010 )
Guest Editors: Moshe Preil and Shaunee Cheng

BioMEMS, Theory and Practice of MEMS/NEMS, and Sensors (July-September 2010)
Guest Editor: Yu-Cheng Lin

Extreme-Ultraviolet Lithography (October-December 2009)
Guest Editors: Kevin Cummings and Kazuaki Suzuki

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS (July-September 2009)
Guest Editors: Rajeshuni Ramesham and Allyson L. Hartzell

Computational Lithography (July-September 2009)
Guest Editors: Donis Flagello and Chris Mack

Theory and Practice of MEMS/NEMS/MOEMS, RF MEMS, and BioMEMS (April-June 2009)
Guest Editor: Yu-Cheng Lin

Extreme-Ultraviolet Interference Lithography (April-June 2009)
Guest Editor: Franco Cerrina

Double-Patterning Lithography (January-March 2009)
Guest Editor: William H. Arnold

Silicon-Based MOEMS and Their Applications (April-June 2008)
Guest Editors: Harald Schenk and Wibool Piyawattanametha

Resolution Enhancement Techniques and Design for Manufacturability (July-September 2007)
Guest Editor: Alfred K. K. Wong

Bio-MEMS and Microfluidics (April-June 2006)
Guest Editors: Wanjun Wang and Ian Papautsky

Nanopatterning (January-March 2006)
Guest Editors: Kees Eijkel, Jill Hruby, Glen Kubiak, M. Scott, Volker Saile, and Steven Walsh

MOEMS Design, Technology, and Applications (October-December 2005)
Guest Editor: M. Edward Motamedi

Polarization and Hyper-NA Lithography (July-September 2005)
Guest Editor: Donis Flagello and Christopher J. Progler

Next Generation Lithography (January-March 2005)
Guest Editor: Walt Trybula

Mask Technology for Optical Lithography (April-June 2004)
Guest Editor: Kevin D. Cummings and Frank M. Schellenberg

Immersion Lithography (January-March 2004)
Guest Editor: William H. Arnold

Surface Micromachining (October-December 2003)
Guest Editors: Jeffry J. Sniegowski and James H. Smith

Micro-Optics for Photonic Networks (October-December 2003)
Guest Editor: Thomas J. Suleski

Lithography for Sub-100-nm Device Fabrication (October-December 2002)
Guest Editor: William H. Arnold

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