31 May 2012 Debris transport analysis at the intermediate focus of an extreme ultraviolet light source
John Sporre, David N. Ruzic
Author Affiliations +
Abstract
As extreme ultraviolet light lithography matures, critical deficits in the technology are being resolved. Research has largely focused on solving the debris issue caused by using warm (Te ∼ 30  eV) and dense (ne ∼ 1020  cm−3) plasma to create 13.5-nm light. This research has been largely focused on the mitigation of the debris between the plasma and the collector optics. The next step of debris mitigation is investigated, namely the effect of debris mitigation on the transport of undesired contaminants to the intermediate focus (IF). In order to investigate emissions from the IF, the Center for Plasma-Material Interactions at the University of Illinois at Urbana-Champaign has developed the Sn intermediate focus flux emission detector. The effects of a secondary RF-plasma, buffer gas flow rate, chamber pressure, and charged plate deflection are investigated. By increasing the chamber pressure to 10 mTorr, flowing 1000 sccm Ar buffer gas, and utilizing charged particle deflection, it is possible to reduce the measured number of post-IF species by greater than 99%. Furthermore, it is shown that typical debris mitigation techniques lead to the development of a plasma near the IF that can be detrimental to post-IF optics.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2012/$25.00 © 2012 SPIE
John Sporre and David N. Ruzic "Debris transport analysis at the intermediate focus of an extreme ultraviolet light source," Journal of Micro/Nanolithography, MEMS, and MOEMS 11(2), 021117 (31 May 2012). https://doi.org/10.1117/1.JMM.11.2.021117
Published: 31 May 2012
Lens.org Logo
CITATIONS
Cited by 4 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Plasma

Extreme ultraviolet

Ions

Tin

Charged particle optics

Light sources

Argon

Back to Top