Lithography assisted self-assembly of contact holes on 300-mm wafer scale

Sander Wuister; Jo Finders; Emiel Peeters; Chris van Heesch

doi:10.1117/1.JMM.11.3.031304

12 July 2012 Lithography assisted self-assembly of contact holes on 300-mm wafer scale

Sander Wuister, Jo Finders, Emiel Peeters, Chris van Heesch

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 11, Issue 3, 031304 (July 2012). https://doi.org/10.1117/1.JMM.11.3.031304

Abstract

Self-assembly of block copolymers is a potential technique to be used in the fabrication of microelectronic devices. In some cases, the self-assembly is directed by means of an additional technique, e.g. photolithography. This paper studies the impact of ArF_i-lithography on the properties of the polymer after the directed assembly. Placement, critical dimension and critical dimension uniformity of the features are analyzed and discussed and compared to an integrated circuit application according to the international technology roadmap for semiconductors roadmap.

Citation Download Citation

Sander Wuister, Jo Finders, Emiel Peeters, and Chris van Heesch "Lithography assisted self-assembly of contact holes on 300-mm wafer scale," Journal of Micro/Nanolithography, MEMS, and MOEMS 11(3), 031304 (12 July 2012). https://doi.org/10.1117/1.JMM.11.3.031304

Published: 12 July 2012

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