16 February 2016 Accurate, full-chip, three-dimensional electromagnetic field model for non-Manhattan mask corners
Author Affiliations +
Abstract
The physical process of mask manufacturing produces absorber geometry with significant deviations from the 90-deg corners, which are typically assumed in the mask design. The non-Manhattan mask geometry is an essential contributor to the aerial image and resulting patterning performance through focus. Current state-of-the-art models for corner rounding employ “chopping” a 90-deg mask corner, replacing the corner with a small 45-deg edge. A methodology is presented to approximate the impact of three-dimensional (3-D) EMF effects introduced by corners with rounded edges. The approach is integrated into a full-chip 3-D mask simulation methodology based on the domain decomposition method with edge to edge crosstalk correction.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2016/$25.00 © 2016 SPIE
Michael C. Lam, Chris Clifford, Mike Oliver, David Fryer, Edita Tejnil, and Kostas Adam "Accurate, full-chip, three-dimensional electromagnetic field model for non-Manhattan mask corners," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(2), 021204 (16 February 2016). https://doi.org/10.1117/1.JMM.15.2.021204
Published: 16 February 2016
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
3D modeling

Photomasks

Near field

Electromagnetism

Lithography

Semiconducting wafers

Scattering

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