Yield-aware mask assignment by positive semidefinite relaxation in triple patterning using cut process

Yukihide Kohira; Chikaaki Kodama; Tomomi Matsui; Atsushi Takahashi; Shigeki Nojima; Satoshi Tanaka

doi:10.1117/1.JMM.15.2.021207

11 March 2016 Yield-aware mask assignment by positive semidefinite relaxation in triple patterning using cut process

Yukihide Kohira, Chikaaki Kodama, Tomomi Matsui, Atsushi Takahashi, Shigeki Nojima, Satoshi Tanaka

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 15, Issue 2, 021207 (March 2016). https://doi.org/10.1117/1.JMM.15.2.021207

Abstract

LELECUT type triple patterning lithography is one of the most promising techniques in 14 nm logic node and beyond. To prevent yield loss caused by overlay error, LELECUT mask assignment, which is tolerant to overlay error, is desired. We propose a method that obtains a LELECUT assignment that is tolerant to overlay error. The proposed method uses positive semidefinite relaxation and randomized rounding technique. In our method, the cost function that takes the length of boundary of features determined by the cut mask into account is introduced.

Citation Download Citation

Yukihide Kohira, Chikaaki Kodama, Tomomi Matsui, Atsushi Takahashi, Shigeki Nojima, and Satoshi Tanaka "Yield-aware mask assignment by positive semidefinite relaxation in triple patterning using cut process," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(2), 021207 (11 March 2016). https://doi.org/10.1117/1.JMM.15.2.021207

Published: 11 March 2016

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