Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition

Anuja De Silva; Indira Seshadri; Kisup Chung; Abraham Arceo; Luciana Meli; Brock Mendoza; Yasir Sulehria; Yiping Yao; Madhana Sunder; Hoa Truong; Shravan Matham; Ruqiang Bao; Heng Wu; Nelson M. Felix; Sivananda Kanakasabapathy

doi:10.1117/1.JMM.16.2.023504

23 May 2017 Development of TiO₂ containing hardmasks through plasma-enhanced atomic layer deposition

Anuja De Silva, Indira Seshadri, Kisup Chung, Abraham Arceo, Luciana Meli, Brock Mendoza, Yasir Sulehria, Yiping Yao, Madhana Sunder, Hoa Truong, Shravan Matham, Ruqiang Bao, Heng Wu, Nelson M. Felix, Sivananda Kanakasabapathy

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 16, Issue 2, 023504 (May 2017). https://doi.org/10.1117/1.JMM.16.2.023504

Abstract

With the increasing prevalence of complex device integration schemes, trilayer patterning with a solvent strippable hardmask can have a variety of applications. Spin-on metal hardmasks have been the key enabler for selective removal through wet strip when active areas need to be protected from dry etch damage. As spin-on metal hardmasks require a dedicated track to prevent metal contamination and are limited in their ability to scale down thickness without compromising on defectivity, there has been a need for a deposited hardmask solution. Modulation of film composition through deposition conditions enables a method to create TiO2 films with wet etch tunability. This paper presents a systematic study on development and characterization of plasma-enhanced atomic layer deposited (PEALD) TiO2-based hardmasks for patterning applications. We demonstrate lithographic process window, pattern profile, and defectivity evaluation for a trilayer scheme patterned with PEALD-based TiO2 hardmask and its performance under dry and wet strip conditions. Comparable structural and electrical performance is shown for a deposited versus a spin-on metal hardmask.

Citation Download Citation

Anuja De Silva, Indira Seshadri, Kisup Chung, Abraham Arceo, Luciana Meli, Brock Mendoza, Yasir Sulehria, Yiping Yao, Madhana Sunder, Hoa Truong, Shravan Matham, Ruqiang Bao, Heng Wu, Nelson M. Felix, and Sivananda Kanakasabapathy "Development of TiO₂ containing hardmasks through plasma-enhanced atomic layer deposition," Journal of Micro/Nanolithography, MEMS, and MOEMS 16(2), 023504 (23 May 2017). https://doi.org/10.1117/1.JMM.16.2.023504

Received: 5 March 2017; Accepted: 28 April 2017; Published: 23 May 2017

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available