1 October 2011 Measurement of nano/micro out-of-plane and in-plane displacements of micromechanical components by using digital holography and speckle interferometry
Giancarlo Pedrini, Igor Alekseenko, Wolfgang Osten, Joao Gaspar, Marek E. Schmidt, Oliver Paul
Author Affiliations +
Abstract
Optical techniques are well suited for the measurement of microcomponents but give accurate results only when calibrated systems are used. We present a strategy for the calibration of setups to be used for the measurements of microsystems. We develop, at first, standard reference devices whose out-of-plane and in-plane displacements are precisely reproducible when submitted to standard loadings. These reference devices have been manufactured and tested by optical techniques and may be used for the calibration of optical measuring systems. Furthermore, a detailed discussion of the measurement uncertainty, according to the ISO's "Guide of Expression of Uncertainty in Measurement," is given.
©(2011) Society of Photo-Optical Instrumentation Engineers (SPIE)
Giancarlo Pedrini, Igor Alekseenko, Wolfgang Osten, Joao Gaspar, Marek E. Schmidt, and Oliver Paul "Measurement of nano/micro out-of-plane and in-plane displacements of micromechanical components by using digital holography and speckle interferometry," Optical Engineering 50(10), 101504 (1 October 2011). https://doi.org/10.1117/1.3572186
Published: 1 October 2011
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CITATIONS
Cited by 27 scholarly publications.
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KEYWORDS
Digital holography

Microelectromechanical systems

Calibration

Standards development

Silicon

Microsystems

Sensors

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