We present on the additive micro-manufacturing of ceramic packaging, containing arbitrarily routed vias with a diameter and pitch as small as 10µm and 20µm, respectively. We accomplish this feat by pairing recently commercialized micro-printers based on digital micromirror devices with our UV curable pre-ceramic resin that enables dielectric ceramic printing. Ceramic interposers with thousands of vias were 3D printed, then metallized and finally indium bump bonded to test chips fabricated by standard semiconductor lithography. This technology enables unprecedented via routing and packaging options for the 3D integration of microelectronic subsystems and focal plane arrays.
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