Alexander Elia
SPIE Involvement:
Area of Expertise:
Optical Measurements on semiconductor devices
Profile Summary

Currently with Global Foundries
Working and collaborating with the integration and device manufacturing teams that are with the GF Alliance partners in developing 20nm & 14nm advanced scatterometry & Optical Metrology solutions.
•Design, execute, and analyze experiments to screen and optimize scatterometry/metrology applications for evaluating new equipment that will meet new technology demands (e.g., performance, yield, and reliability) and manufacturing (e.g., process stability, cost of ownership) targets.
•Engage with equipment suppliers to highlight new scatterometry applications requirements and evaluate new equipment solutions.
•Define and maintain optical metrology applications and equipment roadmaps.
•Transfer technology developed with the alliance partners to the GLOBALFOUNDRIES productions fabs.

M.S. Material Science & Metallurgy 1991
NYU Polytechnic Brooklyn, NY.
Thesis: “ Fabrication of NiAl Intermetallic Composite Coatings by Plasma Spraying”

B.S. Chemistry 1982
C.W. Post College Long Island University, Greenvale, NY

August 2011 – present:
MTS Metrology Process Engineer GLOBALFOUNDRIES East Fishkill & Malta, NY

March 2006 – Aug 2011:
Metrology Process Engineer Tokyo Electron Ltd. East Coast Region

Feb. 2004 to March 2006:
Field Applications Manager Ebara Technologies Inc. East Fishkill, NY

Jan. 1993 to Jan. 2004
Staff Field Process Engineer Lam Research Corporation East Fishkill, NY
Publications (7)

Proceedings Article | 20 March 2020 Presentation + Paper
Proc. SPIE. 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV
KEYWORDS: Metrology, Scatterometry, Machine learning, Semiconducting wafers, Back end of line

SPIE Journal Paper | 14 August 2018
JM3 Vol. 17 Issue 03
KEYWORDS: Semiconducting wafers, Data modeling, Metrology, Reactive ion etching, Diffractive optical elements, Optics manufacturing, Optical lithography, Scatterometry, Overlay metrology, Transmission electron microscopy

Proceedings Article | 28 March 2017 Presentation + Paper
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Ellipsometry, Mueller matrices, Metrology, Diffractive optical elements, 3D modeling, Transmission electron microscopy, Scatterometry, Optical metrology, Process control, Spectroscopic ellipsometry, Critical dimension metrology, Reactive ion etching, Chemical elements, Semiconducting wafers, Optics manufacturing, Overlay metrology

Proceedings Article | 19 March 2015 Paper
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Metrology, Etching, Data processing, Process control, Critical dimension metrology, Reactive ion etching, Algorithm development, Data communications, Semiconducting wafers

SPIE Journal Paper | 6 November 2014
JM3 Vol. 13 Issue 04
KEYWORDS: Line edge roughness, Metrology, Scatterometry, Data modeling, Semiconducting wafers, Critical dimension metrology, Photoresist materials, Transmission electron microscopy, Etching, Scatter measurement

Showing 5 of 7 publications
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