Allyson Hartzell
Director of Technology Projects at Qualcomm Inc.
SPIE Involvement:
Author
Publications (6)

Proceedings Article | 28 July 2010 Paper
Proceedings Volume 7736, 77362D (2010) https://doi.org/10.1117/12.857296
KEYWORDS: Actuators, Microelectromechanical systems, Deformable mirrors, Wavefronts, Electronics, Adaptive optics, Mirrors, Astronomical adaptive optics, Astronomy, Gemini Planet Imager

Proceedings Article | 18 February 2010 Paper
Allyson Hartzell, Steven Cornelissen, Paul Bierden, Charlie Lam, Daniel Davis
Proceedings Volume 7595, 75950B (2010) https://doi.org/10.1117/12.845610
KEYWORDS: Reliability, Actuators, Microelectromechanical systems, Mirrors, Deformable mirrors, Adaptive optics, Yield improvement, Imaging systems, Code division multiplexing, Manufacturing

SPIE Journal Paper | 1 July 2009 Open Access
JM3, Vol. 8, Issue 03, 031301, (July 2009) https://doi.org/10.1117/12.10.1117/1.3236753
KEYWORDS: Reliability, Packaging, Microelectromechanical systems, Microopto electromechanical systems, Nanofabrication

SPIE Journal Paper | 1 July 2007
JM3, Vol. 6, Issue 03, 033010, (July 2007) https://doi.org/10.1117/12.10.1117/1.2775458
KEYWORDS: Mirrors, Reliability, Microelectromechanical systems, Optical design, Packaging, Reflectivity, Microopto electromechanical systems, Tolerancing, Lenses, Silicon

Proceedings Article | 2 October 2001 Paper
Allyson Hartzell, David Woodilla
Proceedings Volume 4558, (2001) https://doi.org/10.1117/12.442987
KEYWORDS: Microelectromechanical systems, Manufacturing, Reliability, Product engineering, High volume manufacturing, Quality systems, Failure analysis, Design for manufacturability, Yield improvement, Databases

Showing 5 of 6 publications
Proceedings Volume Editor (3)

Conference Committee Involvement (12)
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII
3 February 2014 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
4 February 2013 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
23 January 2012 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
24 January 2011 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
25 January 2010 | San Francisco, California, United States
Showing 5 of 12 Conference Committees
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