Wavelength scanning interferometry based on a reflectometry model is proposed for measuring the absolute thickness
profile of a thin silicon wafer. A Fourier-based method of wavelength scanning interferometry is limited to thicker
wafers because of a tuning range limitation of the source. As an example, the minimum thickness measurable with the
conventional Fourier-based technique using a 4 nm-tunable (500 GHz) 1550 nm laser is approximately 170 μm. Our
proposed method enables an extension of thickness measurements with a reduction in systematic measurement error,
representing a significant advance. The so-called 'ripple-error' or 'fringe-bleed through' is much lower with a
reflectometry-based analysis compared to a Fourier-based analysis. Our method was verified by measuring and testing
several wafers with various thicknesses.
Wavelength scanning interferometry offers many advantages over traditional phase shifting interferometry, most
significantly the elimination of mechanical movement of the part/s for phase modulation by implementing a tunable light
source. Further, Fourier analysis on the interference time history enables this technique to accurately measure distances,
treating the distance between two optical surfaces as an interferometric cavity. We propose to evaluate the uncertainty in
the thickness measurement of a transparent cavity using a commercial Fizeau wavelength scanning interferometer. This
work follows the theory and measurement performed in a previous manuscript of measuring absolute distances of
opaque objects using a commercial wavelength scanning interferometer. The limits in measuring a cavity using the
commercial wavelength scanning interferometer depend on many factors such as temperature variations that affect the
test and reference cavity, uncertainty in the reference cavity calibration, tuning rate non-linearities, etc. In addition to an
analytical approach, a simulation is described to better understand the measurement process and the uncertainty
associated in measuring absolute distances (thickness) of cavities. Preliminary experimental results on the absolute
thickness of a transparent cavity are reported along with uncertainty sources.
Wavelength scanning interferometry offers many advantages over traditional phase shifting interferometry, most
significantly the elimination of mechanical movement of the part/s for phase modulation by implementing a tunable light
source. Further, Fourier analysis on the interference time history enables this technique to accurately measure distances,
treating the distance between two optical surfaces as an interferometric cavity. We propose to use a newly acquired
wavelength scanning Fizeau interferometer from Zygo Corporation, the MST (Multiple Surface Transform) to explore
the limits of absolute thickness metrology to measure an opaque cavity, such as a gauge block. While transparent
cavities can be measured with ease in a Fizeau setup, opaque cavities need additional optics. A two mirror Sagnac
configuration in conjunction with the interferometer from Zygo Corporation is used to measure the length (thickness) of
a 1 inch gauge block. Current gauge block measurements rely on comparison methods to determine the fractional length
with respect to a reference or master gauge block or use techniques which require the absolute length of the gauge block
to be previously known. By using wavelength scanning interferometry, the absolute length of the gauge block can be
determined directly within limits of the repeatability of the instrument. While other techniques implement a point by
point approach for measurement or use interpolation methods, we simply use a large aperture to provide the thickness
variation over the sample. Experimental results of a 1 inch gauge block along with an uncertainty estimate are discussed.
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