We have developed an organic-inorganic hybrid resist platform featuring versatile ex-situ control of its performance by incorporating inorganic elements using vapor-phase infiltration (VPI) into standard organic resists. With poly(methyl methacrylate) (PMMA)-AlOx hybrid as a model composition we unveiled controllability of the critical exposure dose, contrast (as high as ~30), and etch resistance; estimated Si etch selectivity over ~300, demonstrating high aspect ratio ~17 with ~30 nm resolution Si fin-structures. Building upon the demonstration of PMMA-AlOx hybrid resist, we expanded our material portfolio to a high sensitivity resist and other inorganic moieties. We present preliminary results obtained from the extreme ultraviolet (EUV) lithography dose tests conducted on corresponding infiltrated hybrids and optimization of infiltration with the help of transmission electron microscopy (TEM).
We demonstrate a simple ex-situ inorganic infiltration route for transforming standard organic resists into high-performance positive tone hybrid resist platform. A model thin film PMMA-AlOx hybrid resist system has been synthesized by hybridization of PMMA with AlOx and investigated for electron beam lithography. The approach possesses full controllability of the resist performance in terms of critical does, patterning contrast reaching up to 30 and etch resistance for plasma-based pattern transfer processes. The high selectivity Si etching capability demonstrated using a low-temperature cryo-Si etch process, based on the controlled infiltration outperforms commercial resists and typical hard mask material thermal SiO2, with estimated achievable selectivity in excess of ~300. Si nanostructures down to ~30 nm with aspect ratio up to ~17 are also transferred into the Si substrate. Easy implementation and adaptability for different inorganic infiltrations, this platform is well capable of potentially delivering the resist performance and throughput necessary for EUV lithography.