While EUV systems equipped with a 0.33 Numerical Aperture (NA) lens are readying to start high volume manufacturing, ASML and Zeiss are in parallel ramping up their activities on an EUV exposure tool with an NA of 0.55.
The purpose of this high-NA scanner, targeting an ultimate resolution of 8nm, is to extend Moore’s law throughout the next decade.
A novel lens design, capable of providing the required Numerical Aperture, has been identified; this lens will be paired with new, faster stages and more accurate sensors enabling the tight focus and overlay control needed for future process nodes.
In this paper an update will be given on the status of the developments at Carl Zeiss and ASML. Next to this, we will address several topics inherent in the new design and smaller target resolution: M3D effects, polarization, focus control and stitching.
While 0.33NA EUV systems are readying to start volume manufacturing, ASML and Zeiss are ramping up development activities on a 0.55NA EUV exposure tool, extending Moore’s law throughout the next decade. A novel, anamorphic lens design, has been developed to provide the NA; this lens will be paired with new, faster stages and more accurate sensors and the tight focus and overlay control needed for future process nodes. This paper presents an overview of the target specifications, key technology innovations and imaging simulations demonstrating the advantages as compared to 0.33NA and showing the capabilities of ASML’s next generation EUV systems.
To enable cost-effective shrink at the 3nm node and beyond, and to extend Moore’s law into the next decade, ASML is developing a new high-NA EUV platform. The high-NA system is targeted to feature a numerical aperture (NA) of 0.55 to extend the single exposure resolution limit to 8nm half pitch. The system is being designed to achieve an on-product-overlay (OPO) performance well below 2nm, a high image contrast to drive down local CD errors and to obtain global CDU at sub-1nm level to be able to meet customer edge placement error (EPE) requirements for the devices of the future. EUV scanners employ reflective Bragg multi-layer mirrors in the mask and in the Projection Optics Box (POB) that is used to project the mask pattern into the photoresist on the silicon wafer. These MoSi multi-layer mirrors are tuned for maximum reflectivity, and thus productivity, at 13.5nm wavelength. The angular range of incident light for which a high reflectivity at the reticle can be obtained is limited to ~ +/- 11o, exceeding the maximum angle occurring in current 0.33NA scanners at 4x demagnification. At 0.55NA the maximum angle at reticle level would extend up to 17o in the critical (scanning) direction and compromise the imaging performance of horizontal features severely. To circumvent this issue a novel anamorphic optics design has been introduced, which has a 4x demagnification in the X- (slit) direction and 8x demagnification in the Y- (scanning) direction as well as a central obscuration in the exit pupil. In this work we will show that the EUV high-NA anamorphic concept can successfully solve the angular reflectivity issues and provide good imaging performance in both directions. Several unique imaging challenges in comparison to the 0.33NA isomorphic baseline are being studied, such as the impact of the central obscuration in the POB and Mask-3D effects at increased NA that seem most pronounced for vertical features. These include M3D induced contrast loss and non-telecentricity. We will explore the solutions needed to mitigate these effects and to offer high quality imaging to be able to meet the required EPE performance in both orientations.
Current extreme ultraviolet (EUV) projection lithography systems exploit a projection lens with a numerical aperture (NA) of 0.33. It is expected that these will be used in mass production in the 2018/2019 timeframe. By then, the most difficult layers at the 7-nm logic and the mid-10-nm DRAM nodes will be exposed. These systems are a more economical alternative to multiple-exposure by 193 argon fluoride immersion scanners. To enable cost-effective shrink by EUV lithography down to 8-nm half pitch, a considerably larger NA is needed. As a result of the increased NA, the incidence angles of the light rays at the mask increase significantly. Consequently, the shadowing and the variation of the multilayer reflectivity deteriorate the aerial image contrast to unacceptably low values at the current 4× magnification. The only solution to reduce the angular range at the mask is to increase the magnification. Simulations show that the magnification has to be doubled to 8× to overcome the shadowing effects. Assuming that the mask infrastructure will not change the mask form factor, this would inevitably lead to a field size that is a quarter of the field size of the current 0.33-NA step and scan systems and reduce the throughput (TPT) of the high-NA scanner to a value below 100 wafers per hour unless additional measures are taken. This paper presents an anamorphic step and scan system capable of printing fields that are half the field size of the current full field. The anamorphic system has the potential to achieve a TPT in excess of 150 wafers per hour by increasing the transmission of the optics, as well as increasing the acceleration of the wafer stage and mask stage. This makes it an economically viable lithography solution.
While EUV systems equipped with a 0.33 Numerical Aperture lenses are readying to start volume manufacturing, ASML and Zeiss are ramping up their activities on a EUV exposure tool with Numerical Aperture of 0.55.
The purpose of this scanner, targeting an ultimate resolution of 8nm, is to extend Moore’s law throughout the next decade.
A novel, anamorphic lens design, capable of providing the required Numerical Aperture has been investigated; This lens will be paired with new, faster stages and more accurate sensors enabling Moore’s law economical requirements, as well as the tight focus and overlay control needed for future process nodes.
The tighter focus and overlay control budgets, as well as the anamorphic optics, will drive innovations in the imaging and OPC modelling.
Furthermore, advances in resist and mask technology will be required to image lithography features with less than 10nm resolution.
This paper presents an overview of the target specifications, key technology innovations and imaging simulations demonstrating the advantages as compared to 0.33NA and showing the capabilities of the next generation EUV systems.
While EUV systems equipped with a 0.33 Numerical Aperture lenses are readying to start volume manufacturing, ASML and Zeiss are ramping up their development activities on a EUV exposure tool with Numerical Aperture greater than 0.5. The purpose of this scanner, targeting a resolution of 8nm, is to extend Moore’s law throughout the next decade.
A novel, anamorphic lens design, has been developed to provide the required Numerical Aperture; this lens will be paired with new, faster stages and more accurate sensors enabling Moore’s law economical requirements, as well as the tight focus and overlay control needed for future process nodes.
The tighter focus and overlay control budgets, as well as the anamorphic optics, will drive innovations in the imaging and OPC modelling, and possibly in the metrology concepts.
Furthermore, advances in resist and mask technology will be required to image lithography features with less than 10nm resolution.
This paper presents an overview of the key technology innovations and infrastructure requirements for the next generation EUV systems.
EUV lithography for resolution below 8 nm half pitch requires the numerical aperture (NA) of the projection lens to be significantly larger than the current state-of-the-art 0.33NA. In order to be economically viable, a throughput in the range of 100 wafers per hour is needed. As a result of the increased NA, the incidence angles of the light rays at the mask increase significantly. Consequently the shadowing and the variation of the multi-layer reflectivity deteriorate the aerial image contrast to unacceptably low values at the current 4x magnification. The only solution to reduce the angular range at the mask is to increase the magnification. Simulations show that we have to double the magnification to 8x in order to overcome the shadowing effects. Assuming that the mask infrastructure will not change the mask form factor, this would inevitably lead to a field size that is a quarter of the field size of current 0.33NA step and scan systems. This would reduce the throughput of the high-NA scanner to a value significantly below 100 wafers per hour unless additional measures are taken. This paper presents an anamorphic step and scan system capable to print fields that are half the field size of the current full field. The anamorphic system has the potential to achieve a throughput in excess of 150 wafers per hour by increasing the transmission of the optics as well as increasing the acceleration of the wafer stage and mask stage. This makes it an economically viable lithography solution. The proposed 4x/8x magnification is not the only logical solution. There are potentially other magnifications to increase the scanner performance while at the same time reducing the m ask requirements.
EUV lithography for resolution below 8 nm half pitch requires the numerical aperture (NA) of the projection lens to be
significantly larger than the current state-of-the-art 0.33NA. In order to be economically viable, a throughput in the range
of 100 wafers per hour is needed.
As a result of the increased NA, the incidence angles of the light rays at the mask increase significantly. Consequently
the shadowing and the variation of the multi-layer reflectivity deteriorate the aerial image contrast to unacceptably low
values at the current 4x magnification.
The only solution to reduce the angular range at the mask is to increase the magnification. Simulations show that we
have to double the magnification to 8x in order to overcome the shadowing effects. Assuming that the mask
infrastructure will not change the mask form factor, this would inevitably lead to a field size that is a quarter of the field
size of current 0.33NA step and scan systems. This would reduce the throughput of the high-NA scanner to a value
significantly below 100 wafers per hour unless additional measures are taken.
This paper presents an anamorphic step and scan system capable to print fields that are half the field size of the current full
field. The anamorphic system has the potential to achieve a throughput in excess of 150 wafers per hour by increasing
the transmission of the optics as well as increasing the acceleration of the wafer stage and mask stage. This makes it an
economically viable lithography solution.
The proposed 4x/8x magnification is not the only logical solution. There are potentially other magnifications to increase
the scanner performance while at the same time reducing the mask requirements.
EUV lithography (EUVL) for a limit resolution below 8 nm requires the numerical aperture (NA) of the projection optics to be larger than 0.50. For such a high-NA optics a configuration of 4x magnification, full field size of 26 x 33 mm² and 6’’ mask is not feasible anymore. The increased chief ray angle and higher NA at reticle lead to non-acceptable mask shadowing effects. These shadowing effects can only be controlled by increasing the magnification, hence reducing the system productivity or demanding larger mask sizes. We demonstrate that the best compromise in imaging, productivity and field split is a so-called anamorphic magnification and a half field of 26 x 16.5 mm² but utilizing existing 6’’ mask infrastructure. We discuss the optical solutions for such anamorphic high-NA EUVL.
New design solutions are available for high-NA EUV optics, maintaining simultaneously superior imaging performance and productivity below 9nm resolution by means of anamorphic imaging. We investigate the imaging properties of these new optics configurations by rigorous simulations, taking into account mask induced effects as well as characteristics of the new optics. We compare the imaging behavior to other, more traditional optics configurations, and show that the productivity gain of our new configurations is indeed obtained at excellent imaging performance.
EUV lithography for resolution below 9 nm requires the numerical aperture of the projection optics to be significantly larger than 0.45. A configuration of 4x magnification, full field size and 6’’ reticle is not feasible anymore. The increased chief ray angle and higher NA at reticle lead to non-acceptable shadowing effects, which can only be controlled by increasing the magnification, hence reducing the system productivity. We demonstrate that the best compromise in imaging, productivity and field split is a so-called anamorphic magnification and a half field of 26 x 16.5 mm². We discuss the optical solutions for anamorphic high-NA lithography.
We demonstrate experimentally for the first time the feasibility of applying SMO technology using pixelated illumination. Wafer images of SRAM contact holes were obtained to confirm the feasibility of using SMO for 22nm node lithography. There are still challenges in other areas of SMO integration such as mask build, mask inspection and repair, process modeling, full chip design issues and pixelated illumination, which is the emphasis in this paper. In this first attempt we successfully designed a manufacturable pixelated source and had it fabricated and installed in an exposure tool. The printing result is satisfactory, although there are still some deviations of the wafer image from simulation prediction. Further experiment and modeling of the impact of errors in source design and manufacturing will proceed in more detail. We believe that by tightening all kind of specification and optimizing all procedures will make pixelated illumination a viable technology for 22nm or beyond.
Publisher's Note: The author listing for this paper has been updated to include Carsten Russ. The PDF has been updated to reflect this change.
We present a comprehensive modeling study of polarization effects for the whole optical chain including exposure tool and mask, with strong emphasis on the impact of the Jones Matrix of the projection lens. First we start with the basic of polarization and then the polarization effect of each components of the optical chain will be discussed. Components investigated are source polarization, rigorous EMF effect, mask blank birefringence, pellicle effect and projection lens. We also focus on comparing the relative merits of different types of representation of Jones matrix of the projection lens and outlined ways to decompose the Jones Matrix. Methodologies such as Pauli matrix, PQM, Jones-Zernike expansion and IPS-Zernike expansion are among the ones investigated. The polarization impact on lithography and OPC on realistic 45nm and 32nm node process levels is discussed. Issues in OPC modeling with Jones Matrix is highlighted. Concerns regarding the standardization of the implementation of Jones Matrix in the lithography community are considered and a standard has been proposed and received wide acceptance. Last we discuss the challenge of using polarization and some novel ideas to deal with polarization in hyper NA era. Throughout the paper the resist component is not included so as to isolate the effect of resist from that of the other components.
A second phase in the immersion era is starting with the introduction of ultra high NA (NA >1) systems. These systems are targeting for 45 nm node device production and beyond. ASML TWINSCAN XT:1700i features a maximum NA of 1.2 and a 26x33 mm2 scanner field size. The projection lens is an in-line catadioptric lens design and the AERIAL XP illumination system enables conventional an off-axis illumination pupil shapes in either polarized or un-polarized modes at maximum light efficiency. In this paper a description and a performance overview of the TWINSCAN XT:1700i is given. We will present and discuss lithographic performance results, with special attention at low-k1 imaging using high NA and polarized illumination. Overlay, focus and productivity performance will also be presented.
To enable optical lithography for sub 55 nm features, ArF immersion lithography requires numerical apertures to be significantly larger than 1 - thus leading to new challenges for optical design. Refractive lens designs are not capable to capture these extreme etendues. Catadioptric lens designs can overcome these fundamental issues by keeping the diameters of the optical materials acceptable. We have studied various catadioptric design approaches. The main criteria used to evaluate the potential of the different solutions include mechanical complexity, reticle compatibility, optical sensitivities, polarization capabilities, image field shape, as well as enabling extendibility to even higher NAs. Our assessment leads us to a new design type called catadioptric in-line design which shows superior performance for high NA systems with NA > 1.1.
We investigate the conquest of sideband laser cooling and heating due to weak broad-band noise for a harmonically trapped two-level ion. The two opposite processes from an equilibrium distribution in the ion's quantum state of motion, i.e., the ground state of motion is depopulated. As another consequence we find population inversion between different manifolds of the ion's combined quantum states of internal electronic structure and external motion. This effect only results from the quantized treatment of the ion's motion.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.