Dr. Bernhard Rebhan Profile

Dr. Bernhard Rebhan

Senior Scientist at EV Group

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Publications (1)

Proceedings Article | 14 June 2017 Paper

Innovative metal thermo-compression wafer bonding for microelectronics and MEMS devices

B. Rebhan, V. Dragoi

Proceedings Volume 10246, 102461H (2017) https://doi.org/10.1117/12.2266492

KEYWORDS: Metals, Wafer bonding, Microelectromechanical systems, Liquids, Microelectronics, Solids, Interfaces, Light emitting diodes, Mirrors, Semiconducting wafers, Copper, Diffusion, Tin, Annealing

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