The thermal droop (reduction of the optical power when the temperature is increased) is a phenomenon that strongly
limits the efficiency of InGaN-based light-emitting diodes. In this paper we analyze the role of Shockley-Read-Hall
(SRH) recombination and of the electron blocking layer (EBL) in the process by using numerical simulations and
literature data. The benefic impact of EBL suggests that carrier escape from the quantum wells gives a significant
contribution to the thermal droop, therefore we review some of the mechanisms described in the literature (thermionic
emission, phonon-assisted tunneling, thermionic trap-assisted tunneling). Since no formulation is able to fit the behavior
of the measured SQW devices, we develop a new model based on two phonon-assisted tunneling steps through a
defective state, extended in order to take into account zero-field emission. By using experimental data, material constants
from the literature and only two fitting parameters the model is able to reproduce the experimental behavior.
Over the last years, important efforts have been done in order to understand the degradation mechanisms of GaN-based
LEDs submitted to forward-bias stress tests. On the other hand, only little work has been done to understand the
degradation of LEDs submitted to reverse-bias stress. However, this topic is of high interest, since (i) the reverse-bias
robustness of the LEDs is strongly correlated to their stability under Electrostatic Discharge (ESD) events and (ii) the
analysis of the reverse-bias degradation can provide important information on the role of high electric fields and reverse
current in limiting the reliability of the LEDs.
Therefore the aim of this paper is to describe a detailed investigation on the reverse-bias degradation of GaN-based
LEDs. The results described in this paper indicate that: (i) under reverse bias, LEDs can show a weak luminescence
signal, due to the recombination of carriers injected in the quantum-wells; (ii) reverse-bias stress can induce the
degradation of the electrical characteristics of the LEDs (increase in reverse-current, decrease in breakdown voltage),
due to the generation of point defects in proximity of pre-existing defective regions. (iii) Furthermore, our tests indicate
that the defective regions responsible for reverse-current conduction can constitute weak points with respect to ESD
events: ESD failures are determined by the shortening of the junction in proximity of one of the defective sites
responsible for reverse-current conduction.
We report on the characterization of V-defects in GaN-based heterostructures via scanning force microscopy techniques.
The diameter and density of the V-defects are found to strongly depend on growth thickness and temperature of the top
layer, respectively, while no correlation between the V-defect formation and the type of doping could be identified.
Kelvin probe force microscopy measurements revealed for both, n- and p-doped GaN top layers, a decrease of the Kelvin
voltage within the V-defects, which indicates an enhanced work function of the facets of the V-defects with respect to
the planar surface. Surprisingly, an increase of the current flow within the V-defects is found by conductive atomic force
microscopy in case of the n-doped top layer, while current flow into the V-defect is suppressed for the p-doped top layer.
For a consistent explanation of these results we suggest a model, which is based on an enhanced electron affinity of the
{10-11}-surfaces within the V-defects as compared to the planar (0001)-surface.
The ThinGaN® technology of OSRAM Opto semiconductors enables high power LEDs with wall plug efficiencies of
currently up to 50%, enabling efficacies of > 100lm/W for white and green LEDs. The good scalability of the technology
enables devices which deliver high luminous flux. The future limitations regarding efficacy of white LED can be
estimated to be 150lm/W for high color rendering. Besides efficiency long term stability and high temperature capability
are requirements for market adoption
With the new Generation of InGaN-based thinfilm Chips efficacies of 110/lm/W and output power of 32 mW at 20 mA
(5 mm Radial lamp, 438nm, chip-size 255&mgr;m x 460&mgr;m) are reached. Due to the scalability of the ThinGaN concept chip
brightness and efficiency are scalable to larger chip sizes: the brightness achieved for a 1 mm2 ThinGaN Power chip at
350 mA were 495mW (445nm) and 202mW or 100 lm (527nm). White LEDs with phosphorus achieved 102 lm at
350mA, mounted in an OSTAR module with six LED chips 1200 lm were demonstrated at 1000 mA driving current.
White emitting automotive headlamp modules with 620lm (5x 1mm2 chip at 700mA) and 41 MCd/m2 as well as green
emitting projection modules with 57 MCd/m2 at 2A/mm2 drive current and 12mm2 chip area are realized. These
technological improvements demonstrate the straight way of GaInN-LEDs for Solid State lighting.
The internal quantum efficiency as a function of the internal electric field was studied in InGaN/GaN based quantumwell
heterostructures. Most striking, we find the IQE to be independent of the electron hole overlap for a standard green-emitting
single quantum-well LED structure. In standard c-plane grown InGaN quantum wells, internal piezo-fields are
responsible for a reduced overlap of electron and hole wavefunction. Minimization of these fields, for example by
growth on non-polar m- and a-planes, is generally considered a key to improve the performance of nitride-based light
emitting devices. In our experiment, we manipulate the overlap by applying different bias voltages to the standard c-plane
grown sample, thus superimposing a voltage induced band-bending to the internal fields. In contrast to the IQE
measurement, the dependence of carrier lifetime and wavelength shift on bias voltage could be explained solely by the
internal piezo-fields according to the quantum confined Stark effect. Measurements were performed using temperature
and bias dependent resonant photoluminescence, measuring luminescence and photocurrent simultaneously.
Furthermore, the doping profile in the immediate vicinity of the QWs was found to be a key parameter that strongly
influences the IQE measurement. A doping induced intrinsic hole reservoir inside the QWs is suggested to enhance the
radiative exciton recombination rate and thus to improve saturation of photoluminescence efficiency.
We demonstrate the potential of Kelvin Probe Force Microscopy (KPFM) for analyzing degradation effects in GaN-based
laser diodes (LDs). Thereby, the surface potential at the mirror facet was measured locally for both, unbiased LDs
and LDs exposed to a well-defined current. In the unbiased case, our KPFM measurements demonstrate the impact of
aging on the mirror facet, which we attribute to a photon enhanced facet oxidation. In case of an externally applied
voltage, the local variation of the Kelvin voltage across the heterostructure layer sequence is analyzed. A clear
correlation between macroscopic I-V-characteristics and the microscopic data obtained with the KPFM is found.
Volker Harle, Berthold Hahn, Johannes Baur, Michael Fehrer, Andreas Weimar, Stephan Kaiser, Dominik Eisert, Franz Eberhard, Andreas Plossl, Stefan Bader
Solid state lighting has seen a rapid development over the last decade. They compete and even outperform light sources like incandescent bulbs and halogen lamps. LEDs are used in applications where brightness, power consumption, reliability and costs are key parameters as automotive, mobile and display applications. In the future LEDs will also enter the market of general lighting. For all of these new applications highly efficient, scalable and cost efficient technologies are required. These targets can be matched by SiC based flip chip LEDs which enable the design of high current chips with efficiencies of up to 28 lm/W in white solderable packages. An alternative approach is the implementation of thinfilm technology for GaInN. The LED is fabricated by transferring the epilayers with laser lift off from sapphire to a GaAs host substrate. In combination with efficient surface roughening and highly reflective p-mirror metalization an extraction efficiency of 70% and wall plug efficiency of 24% at 460 nm have been shown. The chips showed 16 mW @ 20 mA with a Voltage of 3.2 V. The technology is scalable from small size LEDs to high current Chips and is being transferred to mass production.
Data are presented for an GaInN based thinfilm LED. The LED is fabricated by transferring the epilayers with laser lift off from sapphire to a GaAs host substrate. In combination with efficient surface roughening and highly reflective p-mirror metallisation an extraction efficiency of 70% and wall plug efficiency of 24% at 460nm have been shown. The chips showed 12mW @ 20mA with a Voltage of 3.2V. The technology is scalable from small size LEDs to high current Chips and is being transferred to mass production.
ZnSe1-xTex layers were grown by MOVPE on (111) and (001) GaAs substrates at 340 degree(s)C. The growth process of the ternary compound is described by a thermodynamical analysis. The structural quality of the films was determined by x-ray diffraction and transmission electron microscopy. In the present work it is shown that in the case of (001) GaAs substrates the density of misfit dislocation lines extending into the epilayer is reduced drastically by improved oxide removal. For ZnTe/GaAs (111) misfit dislocations can spatially be confined to a narrow (approximately 10 nm) region close to the interface.
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