Dr. Bill W. Wang Profile

Dr. Bill W. Wang

President at CMOS Sensor Inc

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Publications (4)

Proceedings Article | 12 October 2015 Paper

Multiband CMOS sensor simplify FPA design

Weng Lyang Wang, Jer Ling

Proceedings Volume 9639, 96390S (2015) https://doi.org/10.1117/12.2197235

KEYWORDS: Staring arrays, Sensors, CMOS sensors, Image sensors, Electronic circuits, Interfaces, Ceramics, Charge-coupled devices, Silicon, Optical design

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Push broom multi-band Focal Plane Array (FPA) design needs to consider optics, image sensor, electronic, mechanic as well as thermal. Conventional FPA use two or several CCD device as an image sensor. The CCD image sensor requires several high speed, high voltage and high current clock drivers as well as analog video processors to support their operation. Signal needs to digitize using external sample / hold and digitized circuit. These support circuits are bulky, consume a lot of power, must be shielded and placed in close to the CCD to minimize the introduction of unwanted noise. The CCD also needs to consider how to dissipate power. The end result is a very complicated FPA and hard to make due to more weighs and draws more power requiring complex heat transfer mechanisms. In this paper, we integrate microelectronic technology and multi-layer soft / hard Printed Circuit Board (PCB) technology to design electronic portion. Since its simplicity and integration, the optics, mechanic, structure and thermal design will become very simple. The whole FPA assembly and dis-assembly reduced to a few days. A multi-band CMOS Sensor (dedicated as C468) was used for this design. The CMOS Sensor, allow for the incorporation of clock drivers, timing generators, signal processing and digitization onto the same Integrated Circuit (IC) as the image sensor arrays. This keeps noise to a minimum while providing high functionality at reasonable power levels. The C468 is a first Multiple System-On-Chip (MSOC) IC. This device used our proprietary wafer butting technology and MSOC technology to combine five long sensor arrays into a size of 120 mm x 23.2 mm and 155 mm x 60 mm for chip and package, respectively. The device composed of one Panchromatic (PAN) and four different Multi- Spectral (MS) sensors. Due to its integration on the electronic design, a lot of room is clear for the thermal design. The optical and mechanical design is become very straight forward. The flight model FPA passed all of the reliability testing.

Proceedings Article | 9 November 2012 Paper

CMOS sensor for RSI applications

Weng Lyang Wang, Shengmin Lin

Proceedings Volume 8528, 852804 (2012) https://doi.org/10.1117/12.977606

KEYWORDS: CMOS sensors, Sensors, Image sensors, Cameras, Modulation transfer functions, Imaging systems, Analog electronics, Ceramics, Remote sensing, Silicon

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Proceedings Article | 12 August 2009 Paper

First space qualified digital image sensor enters moon orbit

Weng-Lyang Wang, Shengmin Lin, Chi-Pin Lin, Robert Sikora

Proceedings Volume 7458, 74580E (2009) https://doi.org/10.1117/12.824642

KEYWORDS: Cameras, Image sensors, CMOS sensors, Signal to noise ratio, CCD image sensors, Imaging systems, Analog electronics, Sensors, Digital electronics, Image processing

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Proceedings Article | 27 June 2002 Paper

Revised modal strain energy method for finite element analysis of viscoelastic damping treated structures

Yanchu Xu, Yanning Liu, Bill Wang

Proceedings Volume 4697, (2002) https://doi.org/10.1117/12.472676

KEYWORDS: Finite element methods, Modal analysis, Erbium, Metals, Factor analysis, Vibration control, Adhesives, Chemical elements, Materials processing, Structural dynamics

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