We fabricated an arrayed waveguide grating (AWG) demultiplexer for optical fiber communication systems and
photonic integrated circuits. We also used an embossing technique to fabricated the AWG instead of traditional
semiconductor technologies, such as photolithography and etch process. UV curable polymers (ZPU 12-47 and ZPU 12-
45) were used as the core and upper cladding layers. The polydimethylsiloxane (PDMS) mold used for the embossing
process is manufactured by a photoresist structure formed on a silicon wafer. We tried the embossing onto a fused silica
glass using the PDMS mold. After UV curing, the PDMS mold was peeled away carefully, and a pattern of the AWG
demultiplexer was left on the surface of that substrate. The upper cladding layer was coated over the patterned structure.
The fabrication of the AWG demultiplexer was completed by a cleaving process. The residual layer produced after an
embossing process was adjusted by the volume of polymer droplet. The embossing technique will have the potential for
broad applications in fabrication of photonic devices.