Brian W. Kidd
Sr. Applications Engineer at Integrated Designs LP
SPIE Involvement:
Author
Publications (5)

Proceedings Article | 3 April 2008 Paper
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Patents, Image segmentation, Manufacturing, 3D modeling, Photoresist materials, Head, Thin film coatings, Semiconducting wafers, Tolerancing

Proceedings Article | 26 March 2008 Paper
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Optical lithography, Deep ultraviolet, Error analysis, Silicon, Control systems, Telecommunications, Data communications, Photoresist processing, Semiconducting wafers, Signal detection

Proceedings Article | 29 March 2006 Paper
Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII
KEYWORDS: Deep ultraviolet, Particles, Error analysis, Silicon, Manufacturing, Control systems, Photoresist materials, Telecommunications, Data communications, Semiconducting wafers

Proceedings Article | 14 May 2004 Paper
Proc. SPIE. 5376, Advances in Resist Technology and Processing XXI
KEYWORDS: Optical lithography, Diffractive optical elements, Etching, Coating, Manufacturing, Photoresist materials, Reactive ion etching, Thin film coatings, Semiconducting wafers, Bottom antireflective coatings

Proceedings Article | 12 June 2003 Paper
Proc. SPIE. 5039, Advances in Resist Technology and Processing XX
KEYWORDS: Diffractive optical elements, Sensors, Digital filtering, Particles, Coating, Chemistry, Manufacturing, Thin film coatings, Semiconducting wafers, Bottom antireflective coatings

SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top