Dr. Chung-en Zah
SPIE Involvement:
Conference Program Committee | Author
Publications (40)

Proceedings Article | 10 October 2020 Poster + Presentation + Paper
Proc. SPIE. 11545, Semiconductor Lasers and Applications X
KEYWORDS: Packaging, Manufacturing, Laser applications, Laser development, Solid state lasers, Semiconductor lasers, Laser systems engineering

SPIE Journal Paper | 9 March 2020
OE Vol. 59 Issue 03
KEYWORDS: Near field, Semiconductor lasers, Laser bonding, Copper, Silicon carbide, Aluminum nitride, Laser welding, Optical engineering, Near field optics, Beam shaping

Proceedings Article | 21 February 2020 Presentation + Paper
Proc. SPIE. 11261, Components and Packaging for Laser Systems VI
KEYWORDS: Packaging, Continuous wave operation, High power lasers, Resistance, Semiconductor lasers, Laser bonding

Proceedings Article | 21 February 2020 Presentation + Paper
Proc. SPIE. 11261, Components and Packaging for Laser Systems VI
KEYWORDS: Q switching, LIDAR, Nd:YAG lasers, Solid state lasers, Laser crystals, Q switched lasers, Temperature metrology

Proceedings Article | 21 February 2020 Paper
Proc. SPIE. 11261, Components and Packaging for Laser Systems VI
KEYWORDS: Mathematical modeling, Packaging, High power lasers, Resistance, 3D modeling, Semiconductor lasers, Thermal effects, Thermal modeling

Showing 5 of 40 publications
Proceedings Volume Editor (1)

SPIE Conference Volume | 31 January 2005

Conference Committee Involvement (9)
Components and Packaging for Laser Systems VII
6 March 2021 | San Francisco, California, United States
Components and Packaging for Laser Systems VI
3 February 2020 | San Francisco, California, United States
Components and Packaging for Laser Systems V
4 February 2019 | San Francisco, California, United States
Components and Packaging for Laser Systems IV
30 January 2018 | San Francisco, California, United States
Components and Packaging for Laser Systems III
31 January 2017 | San Francisco, California, United States
Showing 5 of 9 Conference Committees
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