Dr. Charles J. Neef Profile

Dr. Charles J. Neef

Scientist at Brewer Science Inc

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Author

Publications (8)

Proceedings Article | 1 April 2009 Paper

Effects of carbon/hardmask interactions on hardmask performance

Zhimin Zhu, Chris James, Michael Weigand, Brian Smith, Charles Neef

Proceedings Volume 7273, 727311 (2009) https://doi.org/10.1117/12.814257

KEYWORDS: Carbon, Silicon, Silicon carbide, Etching, Photoresist materials, Lithography, Silicon films, Semiconducting wafers, Chemistry, Epoxies

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Proceedings Article | 26 March 2008 Paper

Effects of bake temperature and surface modifications on hardmask materials for trilayer applications

Charles Neef, Jim Finazzo, Michael Weigand, Cheryl Nesbit

Proceedings Volume 6923, 692331 (2008) https://doi.org/10.1117/12.771701

KEYWORDS: Etching, Silicon, Photoresist materials, Semiconducting wafers, Temperature metrology, Titanium, Chemistry, Lithography, Crystals, Carbon

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Proceedings Article | 2 April 2007 Paper

Materials for and performance of multilayer lithography schemes

Yubao Wang, James Claypool, Charles Neef, Kevin Edwards, Zhimin Zu, Marc Weimer

Proceedings Volume 6519, 65192S (2007) https://doi.org/10.1117/12.712342

KEYWORDS: Reflectivity, Silicon, Lithography, System on a chip, Etching, Multilayers, Photomasks, Semiconducting wafers, Plasma etching, Plasma

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Proceedings Article | 30 March 2007 Paper

A novel 248-nm wet-developable BARC for trench applications

Debra Thomas, Charles Neef

Proceedings Volume 6519, 65192Z (2007) https://doi.org/10.1117/12.712459

KEYWORDS: Lithography, Semiconducting wafers, Reflectivity, Silicon, Chromophores, Argon, Temperature metrology, Photoresist materials, Critical dimension metrology, Photoresist developing

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Proceedings Article | 14 May 2004 Paper

New BARC materials for the 65-nm node in 193-nm lithography

Cheryl Nesbit, Mariya Nagatkina, Charles Neef, Vandana Krishnamurthy, Michelle Windsor, Evan Bryant

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.535423

KEYWORDS: Reflectivity, Photoresist materials, Silicon, Lithography, Etching, Semiconducting wafers, Optical lithography, Photoresist developing, Bottom antireflective coatings, Resistance

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Proceedings Article | 14 May 2004 Paper

A planarization process for multi-layer lithography applications

Mark Daffron, Charles Neef, Wu-Sheng Shih

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.535303

KEYWORDS: Semiconducting wafers, Optical lithography, Lithography, Scanning electron microscopy, Image processing, Photoresist materials, Plasma etching, Chemical mechanical planarization, Coating, Materials processing

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Proceedings Article | 12 June 2003 Paper

New materials for 193-nm BARC application

Michelle Windsor, Michelle Fowler, Cheryl Nesbit, Charles Neef

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485108

KEYWORDS: Reflectivity, Photoresist materials, Etching, Silicon, Semiconducting wafers, Refractive index, Silicon films, Photoresist developing, Lithography, Optical lithography

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Proceedings Article | 12 June 2003 Paper

Novel spin-bowl-compatible wet developable bottom antireflective coating for i-line applications

Stephen Turner, Charles Neef, Vandana Krishnamurthy

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.483736

KEYWORDS: Semiconducting wafers, Reflectivity, Bottom antireflective coatings, Metals, Refractive index, Optical lithography, Capacitors, Photoresist materials, Contamination, Oxides

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Showing 5 of 8 publications

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