As the development cost of a typical system-on-chip (SOC) using state-of-the-art technology soars, more and more
people turn to three-dimensional (3D) integration for possible alternatives that provide better or equal performance with
lower cost. Stacking dies using the through-silicon-via (TSV) technology has been considered one of the most promising
solutions to extending the life of Moore's law in semiconductor industry, but of course there are problems to be solved
before the infrastructure can be set up to support the industry for manufacturing TSV-based 3D integrated devices. In this
paper we will discuss the opportunities, design and manufacturing issues, and possible solutions for 3D integrated
devices, from a designer's perspective.
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