Mr. Chin-Cheng Yang Profile

Chin-Cheng Yang

Manager at Macronix International Co Ltd

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Author

Publications (16)

Proceedings Article | 27 April 2023 Poster + Paper

Investigation of device overlay variation and control metrology in 3D-NAND process

Yu-Lin Liu, Li-Ting Chang, Kai-Bang Hsu, Mars Yang, Elvis Yang, T. Yang, K. Chen

Proceedings Volume 12496, 1249628 (2023) https://doi.org/10.1117/12.2657015

KEYWORDS: Overlay metrology, Semiconducting wafers, Single crystal X-ray diffraction, Metrology, Etching, Reflection, Coating stress, Process control, Control systems, Modeling

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Proceedings Article | 26 May 2022 Poster + Presentation + Paper

In device overlay control with multiple overlay metrology in 3D-NAND process

Li-Ting Chang, Yu-Lin Liu, Chi-hao Huang, Rishabh Kushwaha, Yen Chun Chuan Sun, Cheng Hung Wu, Shao Chang Cheng, Hsiao Fei Su, Yen Hung Liu, Mars Yang, Elvis Yang, T. H. Yang, K. C. Chen

Proceedings Volume 12053, 120531P (2022) https://doi.org/10.1117/12.2613193

KEYWORDS: Overlay metrology, Single crystal X-ray diffraction, Metrology, Semiconducting wafers, 3D metrology, Control systems, Process modeling, Polishing, Etching, Image processing

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Proceedings Article | 22 February 2021 Poster + Presentation + Paper

Imaging-based overlay metrology optimized by HV-SEM in 3D-NAND process

Yu-Lin Liu, Li-Ting Chang, Chi-Hao Huang, Mars Yang, Elvis Yang, T. H. Yang, K. C. Chen

Proceedings Volume 11611, 116112M (2021) https://doi.org/10.1117/12.2583609

KEYWORDS: Overlay metrology, Optical filters, Semiconducting wafers, Optical testing, Etching, Detection and tracking algorithms, Wafer-level optics, Optical metrology, Metrology, Inspection

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Proceedings Article | 8 March 2016 Paper

Within-wafer CD variation induced by wafer shape

Chi-hao Huang, Mars Yang, Elvis Yang, T. H. Yang, K. C. Chen

Proceedings Volume 9778, 97783E (2016) https://doi.org/10.1117/12.2216048

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Etching, Temperature metrology, Image processing, Process control, Compact discs, Scanners, Defect detection, Distortion, Diffusion, Optical lithography, Scanning electron microscopy

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In order to meet the increasing storage capacity demand and reduce bit cost of NAND flash memories, 3D stacked vertical flash cell array has been proposed. In constructing 3D NAND flash memories, the bit number per unit area is increased as increasing the number of stacked layers. However, the increased number of stacked layers has made the film stress control extremely important for maintaining good process quality. The residual film stress alters the wafer shape accordingly several process impacts have been readily observed across wafer, such as film deposition non-uniformity, etch rate non-uniformity, wafer chucking error on scanner, materials coating/baking defects, overlay degradation and critical dimension (CD) non-uniformity.

The residual tensile and compressive stresses on wafers will result in concave and convex wafer shapes, respectively. This study investigates within-wafer CD uniformity (CDU) associated with wafer shape change induced by the 3D NAND flash memory processes. Within-wafer CDU was correlated with several critical parameters including different wafer bow heights of concave and convex wafer shapes, photo resists with different post exposure baking (PEB) temperature sensitivities, and DoseMapper compensation. The results indicated the trend of within-wafer CDU maintains flat for convex wafer shapes with bow height up to +230um and concave wafer shapes with bow height ranging from 0 ~ -70um, while the within-wafer CDU trends up from -70um to -246um wafer bow heights. To minimize the within-wafer CD distribution induced by wafer warpage, carefully tailoring the film stack and thermal budget in the process flow for maintaining the wafer shape at CDU friendly range is indispensable and using photo-resist materials with lower PEB temperature sensitivity is also suggested. In addition, DoseMapper compensation is also an alternative to greatly suppress the within-wafer CD non-uniformity but the photo-resist profile variation induced by across-wafer PEB temperature non-uniformity attributed to wafer warpage is uncorrectable, and the photo-resist profile variation is believed to affect across-wafer etch bias uniformity to some degree.

Proceedings Article | 19 March 2015 Paper

CD uniformity improvement of dense contact array in negative tone development process

Fengnien Tsai, Teng-hao Yeh, C. Yang, Elvis Yang, T. Yang, K. C. Chen

Proceedings Volume 9424, 94242J (2015) https://doi.org/10.1117/12.2083674

KEYWORDS: SRAF, Reticles, Critical dimension metrology, Photomasks, Lithography, Array processing, Imaging arrays, Semiconducting wafers, Optical lithography, Modulation

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Proceedings Article | 12 April 2013 Paper

SMO and NTD for robust single exposure solution on contact patterning for 40nm node flash memory devices

Chih-Chieh Yu, C. C. Yang, Elvis Yang, T. H. Yang, K. C. Chen, Chih-Yuan Lu

Proceedings Volume 8683, 868322 (2013) https://doi.org/10.1117/12.2010736

KEYWORDS: Photomasks, SRAF, Source mask optimization, Semiconducting wafers, Optical lithography, Critical dimension metrology, Electroluminescence, Immersion lithography, Manufacturing, Image processing

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Proceedings Article | 19 March 2012 Paper

Post-developed defect in word-line SADP process

P. Cheng, F. Tsai, C. Yang, Elvis Yang, T. Yang, K. Chen, Chih-Yuan Lu

Proceedings Volume 8325, 83252J (2012) https://doi.org/10.1117/12.914766

KEYWORDS: Distortion, Semiconducting wafers, Photomasks, Satellites, Etching, Polymers, Lithography, Photoresist processing, Defect inspection, Double patterning technology

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Proceedings Article | 19 March 2012 Paper

Pattern dependent satellite defects in via lithography

Chih-Chieh Yu, Mars Yang, Elvis Yang, T. Yang, K. Chen, Chih-Yuan Lu

Proceedings Volume 8325, 83252K (2012) https://doi.org/10.1117/12.915572

KEYWORDS: Satellites, Semiconducting wafers, Photomasks, Lithography, Polymers, Standards development, Photoresist processing, Inspection, Optical lithography, Etching

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Proceedings Article | 4 March 2010 Paper

Novel ATHENA mark design to enhance alignment quality in double patterning with spacer process

L. W. Chen, Mars Yang, Elvis Yang, T. H. Yang, K. C. Chen, Chih-Yuan Lu

Proceedings Volume 7640, 764020 (2010) https://doi.org/10.1117/12.846014

KEYWORDS: Optical alignment, Double positive medium, Etching, Image segmentation, Photomasks, Double patterning technology, Optical lithography, Semiconducting wafers, Scanners, Signal processing

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Proceedings Article | 7 March 2008 Paper

A comprehensive comparison between double patterning and double patterning with spacer on sub-50nm product implementation

C. F. Tseng, C. C. Yang, Elvis Yang, T. H. Yang, K. C. Chen, C. Y. Lu

Proceedings Volume 6924, 69241Y (2008) https://doi.org/10.1117/12.769904

KEYWORDS: Double patterning technology, Etching, Critical dimension metrology, Photomasks, Lithography, Overlay metrology, Optical lithography, Oxides, Manufacturing, Tolerancing

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Proceedings Article | 5 April 2007 Paper

The novel advanced process control to eliminate AlCu-PVD induced overlay shift

CH Huang, CC Yang, Elvis Yang, TH Yang, KC Chen, Joseph Ku, CY Lu

Proceedings Volume 6518, 651845 (2007) https://doi.org/10.1117/12.706758

KEYWORDS: Metals, Overlay metrology, Etching, Chemical mechanical planarization, Semiconducting wafers, Image registration, Process control, Tungsten, Model-based design, Tolerancing

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Proceedings Article | 20 March 2006 Paper

Dual antireflection layers for ARC/hard-mask applications

Victor Huang, T.S. Wu, Mars Yang, Francis Lin, Elvis Yang, T.H. Yang, K.C. Chen, Joseph Ku, C.Y. Lu

Proceedings Volume 6154, 61543Q (2006) https://doi.org/10.1117/12.656093

KEYWORDS: Reflectivity, Critical dimension metrology, Lithography, Etching, Interfaces, Optical lithography, Antireflective coatings, Dielectrics, Oxides, Photomasks

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Proceedings Article | 12 May 2005 Paper

A novel assist feature for contact holes to overcome problematic pitches

Mars Yang, Francis Lin, Elvis Yang, T. Yang, K. Chen, Joseph Ku, C. Lu

Proceedings Volume 5754, (2005) https://doi.org/10.1117/12.600244

KEYWORDS: Atrial fibrillation, Critical dimension metrology, Printing, Photomasks, Manufacturing, Optical design, Transmittance, Scattering, Imaging arrays, Mars

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Proceedings Article | 2 June 2000 Paper

Diffusion and adsorption mechanism of metallic impurities from chemically amplified photoresist onto silicon-based substrates

ChinCheng Yang, Fu-Hsiang Ko, Mei-Ya Wang, Tien-Ko Wang, Tiao-Yuan Huang

Proceedings Volume 3998, (2000) https://doi.org/10.1117/12.386511

KEYWORDS: Diffusion, Photoresist materials, Silicon, Metals, Barium, Zinc, Cesium, Adsorption, Manganese, Transition metals

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Proceedings Article | 2 June 2000 Paper

Characterization and modeling of out-diffusion of cesium, manganese, and zinc impurities from deep-ultraviolet photoresist

Fu-Hsiang Ko, Mei-Ya Wang, Tien-Ko Wang, ChinCheng Yang, Tiao-Yuan Huang, ChengSan Wu

Proceedings Volume 3998, (2000) https://doi.org/10.1117/12.386507

KEYWORDS: Diffusion, Photoresist materials, Deep ultraviolet, Silicon, Zinc, Manganese, Cesium, Lithography, Semiconducting wafers, Metals

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Proceedings Article | 11 June 1999 Paper

Characterization and lithographic parameter extraction for the modified resists

Fu-Hsiang Ko, June-Kuen Lu, Tien-Chi Chu, Tiao-Yuan Huang, ChinCheng Yang, Jinn-Tsair Sheu, Hui-Ling Huang

Proceedings Volume 3678, (1999) https://doi.org/10.1117/12.350225

KEYWORDS: Polymers, Picture Archiving and Communication System, Lithography, Semiconducting wafers, FT-IR spectroscopy, Transmittance, Absorbance, Absorption, Photoresist processing, Quartz

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Showing 5 of 16 publications

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