Conventional photomask inspection techniques utilize global sensitivity for all inspected area in the die; SRAF and OPC
features become the sensitivity-limiters for advanced photomasks which can result in reduced sensitivity to defects of
interest (DOI). We describe the implementation of Sensitivity Control Layer (SCL), a novel database inspection
methodology for the KLA-Tencor TerascanHR platform to improve sensitivity and reduce nuisance detections. This
methodology enables inspection at maximum sensitivity in critical die-areas via "layer definition" and reducing
sensitivity to sub-resolution features during inspection which can dramatically improve false-rate. DRAM and FLASH
inspection performance was improved through the use of up to 6-control layers to increase sensitivity in the active area
while reducing false detections by as much as 100X. Post-inspection defect analysis, and improved disposition accuracy
of the SCL-enabled inspections will also benefit cycle time and higher throughput. In all test cases, sensitivity
parameters were increased in the regions of interest over baseline inspections run with typical, production-type
inspection methodologies. SCL inspection-sensitivity management, and layer partitioning of OPC structures, SRAF's,
and other sub-resolution features is discussed in detail.
Conventional photomask inspection techniques utilize global sensitivity for all inspected area in the die; SRAF and OPC
features become the sensitivity-limiters, which can result in reduced visibility to defects of interest (DOI). We describe
the implementation of Sensitivity Control Layer (SCL), a novel database inspection methodology for the KLA-Tencor
TerascanHR platform. This methodology enables inspection at maximum sensitivity in critical die-areas via "layer
definition" during job set-up and sensitivity management of the layers during inspection. Memory device inspection
performance was improved through the use of up to six control layers to increase sensitivity in the active area while
reducing nuisance detections by as much as 100X. The corresponding inspection time was reduced by 30%, illustrating
the potential for substantial throughput advantage using SCL. Post-inspection analysis and improved disposition
accuracy of the SCL-enabled inspections will also benefit cycle time and higher throughput. In all test cases, sensitivity
parameters were increased in the regions of interest over baseline inspections run with typical production-use
methodologies. SCL inspection management and application on OPC structures, SRAFs, and MRC violations (slivers)
are discussed in detail.
KEYWORDS: Optical proximity correction, Chemical mechanical planarization, Resolution enhancement technologies, Optimization (mathematics), Manufacturing, Photomask technology, Ranging, System on a chip, Analog electronics
Filling for the prevention of CMP dishing and resolution enhancement technologies (OPC, PSM) can cause the size of IC designs represented in the popular GDSII Stream format to balloon by a factor of ten or more, resulting file sizes of tens of gigabytes and longer throughput times for the tools that must subsequently process the files. We describe the effects of optimizing GDSII Stream files on the tape-out flow. GDSII Stream file sizes can be reduced by as much as 95% (20X reduction) and subsequent tool throughput improved by factors of up to five (5X runtime improvement).
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