Proceedings Article | 24 March 2009
Proc. SPIE. 7272, Metrology, Inspection, and Process Control for Microlithography XXIII
KEYWORDS: Signal to noise ratio, Reticles, Logic, Detection and tracking algorithms, Imaging systems, Sensors, Inspection, SRAF, Prototyping, Digital breast tomosynthesis
A prototype die-to-database high-resolution reticle defect inspection system has been developed for 32nm and below
logic reticles, and 4X Half Pitch (HP) production and 3X HP development memory reticles. These nodes will use
predominantly 193nm immersion lithography (with some layers double patterned), although EUV may also be used.
Many different reticle types may be used for these generations including: binary (COG, EAPSM), simple tritone,
complex tritone, high transmission, dark field alternating (APSM), mask enhancer, CPL, and EUV. Finally, aggressive
model based OPC is typically used, which includes many small structures such as jogs, serifs, and SRAF (sub-resolution
assist features), accompanied by very small gaps between adjacent structures. The architecture and performance of the
prototype inspection system is described. This system is designed to inspect the aforementioned reticle types in die-todatabase
mode. Die-to-database inspection results are shown on standard programmed defect test reticles, as well as
advanced 32nm logic, and 4X HP and 3X HP memory reticles from industry sources. Direct comparisons with currentgeneration
inspection systems show measurable sensitivity improvement and a reduction in false detections.
