Dr. Poenar Daniel Puiu Profile

Dr. Poenar Daniel Puiu

Associate Professor at Nanyang Technological Univ

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Publications (5)

SPIE Journal Paper | 9 January 2018

Fabrication of silicon-embedded low resistance high-aspect ratio planar copper microcoils

Zishan Ali Syed Mohammed, Poenar Daniel Puiu, Sheel Aditya

JM3, Vol. 17, Issue 01, 014501, (January 2018) https://doi.org/10.1117/12.10.1117/1.JMM.17.1.014501

KEYWORDS: Copper, Silicon, Resistance, Electroplating, Etching, Diffractive optical elements, Wet etching, Semiconducting wafers, Signal to noise ratio, Plating

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Proceedings Article | 5 January 2009 Paper

Low-stress PECVD amorphous silicon carbide (α-SiC) layers for biomedical application

Jiashen Wei, Bangtao Chen, Daniel Poenar, Yong Yeow Lee, Ciprian Iliescu

Proceedings Volume 7269, 72690C (2009) https://doi.org/10.1117/12.810883

KEYWORDS: Plasma enhanced chemical vapor deposition, Silicon carbide, Silicon, Semiconducting wafers, Refractive index, Biomedical optics, Etching, Ions, Crystals, Amorphous silicon

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Proceedings Article | 14 December 2006 Paper

Novel microfluidic device for cell characterization by impedance spectroscopy

Ciprian Iliescu, Daniel Poenar, Kwong Joo Leck, Mihaela Carp, Ah Ju Pang, Felicia Loe, Florina Iliescu

Proceedings Volume 6416, 64160F (2006) https://doi.org/10.1117/12.696489

KEYWORDS: Semiconducting wafers, Microfluidics, Glasses, Electrodes, Dielectric spectroscopy, Photomasks, Wafer bonding, Adhesives, Phase measurement, Yeast

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The paper presents a novel microfluidic device for identification and characterization of cells in suspensions using impedance spectroscopy. The device consists of two glass wafers: a bottom wafer comprising a microfluidic channel with two electrodes added for impedance measurement, and a top glass wafer in which inlets and outlets are realized. The fact that the device is glass-based provides a few key advantages: reduced influence from parasitic components during measurements (due to the good isolation properties of the substrate), optical transparency and hydrophilic surface of the microfluidic channel. The latter feature is especially important as it enables sample suction due to capillarity forces only. Thus, no external pumping is required and only a small volume sample suffices for the measurement. The fabrication process of this device consists of three major steps. First, via-holes and inlet/outlet holes are executed in the top glass wafer by wet etching in a 49% HF solution using a low stress amorphous silicon/silicon carbide/photoresist mask. Second, the microfluidic channel is etched into the bottom wafer and Ti/Pt electrodes are then patterned on top of it using a spray coating-based lithography. The last processing step is bonding together the top and bottom glass wafers by employing a very thin adhesive intermediate layer (SU8). This adhesive layer was applied selectively only on the bottom die, from a Teflon cylinder, using a contact imprinting method. Finally, fabricated devices were successfully tested using DI water, phosphate buffer saline (PBS), and various types of both dead cells and living cells resuspended in PBS. Clear differences between dead and live cells have been observed. The impedance measurements were carried out in the frequency range 5 kHz to 10 MHz. The measured magnitude and phase were studied using different types of cells in Dulbecco's Minimal Essential medium (DMEM). The obtained impedance spectra revealed the characteristic spectra signature for each type of cell.

Proceedings Article | 7 May 1999 Paper

Implementing an integrated infrared spectrometer: a theoretical study

Daniel Poenar

Proceedings Volume 3740, (1999) https://doi.org/10.1117/12.347717

KEYWORDS: Sensors, Diffraction gratings, Spectroscopy, Detector arrays, Infrared spectroscopy, Mirrors, Infrared radiation, Semiconducting wafers, Diffraction, Microelectronics

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Proceedings Article | 13 September 1995 Paper

Active interference filters using silicon-compatible materials

D. Poenar, Patrick French, Reinoud Wolffenbuttel

Proceedings Volume 2641, (1995) https://doi.org/10.1117/12.220939

KEYWORDS: Sensors, Interference filters, Silicon, Diodes, Multilayers, Oxides, Refractive index, Silicon films, Antireflective coatings, Photodiodes

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