Dr. David J. Abdallah Profile

Dr. David J. Abdallah

Senior Research Scientist at AZ Electronic Materials USA Corp

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Author

Publications (12)

Proceedings Article | 11 December 2009 Paper

Image reversal trilayer materials and processing

David Abdallah, Kazunori Kurosawa, Elizabeth Wolfer, Victor Monreal, M. Dalil Rahman, DongKwan Lee, Mark Neisser, Ralph Dammel

Proceedings Volume 7520, 75200L (2009) https://doi.org/10.1117/12.837017

KEYWORDS: Etching, Image processing, Photoresist materials, Photomasks, Carbon, Fourier transforms, Lithography, Silicon, Coating, Oxygen

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Proceedings Article | 1 April 2009 Paper

Double imaging with resist freezing in a vapor reaction chamber

Ralph Dammel, Yusuke Takano, Richard Collett, David Abdallah

Proceedings Volume 7273, 72731F (2009) https://doi.org/10.1117/12.815138

KEYWORDS: Semiconducting wafers, Electronic design automation, Image processing, FT-IR spectroscopy, Photoresist processing, Double patterning technology, Fourier transforms, Nitrogen, Photoresist materials, Head-mounted displays

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Proceedings Article | 1 April 2009 Paper

Image reversal trilayer process using standard positive photoresist

David Abdallah, John Sagan, Kazunori Kurosawa, Jin Li, Yusuke Takano, Yasuo Shimizu, Ninad Shinde, Tatsuro Nagahara, Tomonori Ishikawa, Ralph Dammel

Proceedings Volume 7273, 72732K (2009) https://doi.org/10.1117/12.815149

KEYWORDS: Etching, Image processing, Photoresist materials, Silicon, Photomasks, Oxygen, Semiconducting wafers, Lithography, Carbon, Optical lithography

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Proceedings Article | 4 December 2008 Paper

Spin-on trilayer scheme: enabling materials for extension of ArF immersion lithography to 32nm node and beyond

Ruzhi Zhang, Allen Timko, Lyudmila Pylneva, Jennifer Loch, Hengpeng Wu, David Abdallah, Richard Collett, Yayi Wei, Dalil Rahman, Douglas McKenzie, Ping-Hung Lu, Mark Neisser

Proceedings Volume 7140, 71402T (2008) https://doi.org/10.1117/12.804748

KEYWORDS: Silicon, Etching, Reflectivity, Semiconducting wafers, Polymers, Lithography, Photoresist materials, Immersion lithography, Coating, Fourier transforms

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Proceedings Article | 15 April 2008 Paper

Etching spin-on trilayer masks

David Abdallah, Shinji Miyazaki, Aritaka Hishida, Allen Timko, Douglas McKenzie, Dalil Rahman, WooKyu Kim, Lyudmila Pylneva, Hengpeng Wu, Ruzhi Zhang, Ping-Hung Lu, Mark Neisser, Ralph Dammel

Proceedings Volume 6923, 69230U (2008) https://doi.org/10.1117/12.772691

KEYWORDS: Etching, Oxygen, Carbon, Semiconducting wafers, Reactive ion etching, Photomasks, Photoresist materials, Fourier transforms, Silicon, Lithography

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Proceedings Article | 6 April 2007 Paper

Organic ArF bottom anti-reflective coatings for immersion lithography

Zhong Xiang, Hong Zhuang, Hengpeng Wu, Jianhui Shan, Dave Abdallah, Jian Yin, Salem Mullen, Huirong Yao, Eleazar Gonzalez, Mark Neisser

Proceedings Volume 6519, 651929 (2007) https://doi.org/10.1117/12.710669

KEYWORDS: Etching, Reflectivity, Immersion lithography, Photomasks, Chemical vapor deposition, Lithography, Bottom antireflective coatings, Semiconducting wafers, Control systems, Signal attenuation

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Proceedings Article | 2 April 2007 Paper

Spin-on trilayer approaches to high NA 193nm lithography

D. Abdallah, D. McKenzie, A. Timko, A. Dioses, F. Houlihan, D. Rahman, S. Miyazaki, R. Zhang, W. Kim, H. Wu, L. Pylneva, P.-H. Lu, M. Neisser, R. Dammel, J. Biafore

Proceedings Volume 6519, 65190M (2007) https://doi.org/10.1117/12.712700

KEYWORDS: Silicon, Etching, Fourier transforms, Carbon, Lithography, Antireflective coatings, Reflectivity, Semiconducting wafers, Photomasks, Silicon carbide

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Proceedings Article | 29 March 2006 Paper

The effects of etch chemistry on the etch rates of ArF BARC products

Hong Zhuang, Dave Abdallah, Zhong Xiang, Hengpeng Wu, Jianhui Shan, Ping-Hung Lu, Mark Neisser, Eugene Karwacki, Bing Ji, Peter Badowski

Proceedings Volume 6153, 61530N (2006) https://doi.org/10.1117/12.657128

KEYWORDS: Etching, Reactive ion etching, Chemistry, Polymers, Anisotropic etching, Ions, Semiconducting wafers, Photoresist materials, Oxygen, Gases

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Proceedings Article | 4 May 2005 Paper

Resist component leaching in 193-nm immersion lithography

Ralph Dammel, Georg Pawlowski, Andrew Romano, Frank Houlihan, Woo-Kyu Kim, Raj Sakamuri, David Abdallah

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.600782

KEYWORDS: Photoresist materials, Semiconducting wafers, Immersion lithography, Systems modeling, Lithography, Interfaces, Diffusion, Photoresist developing, Coating, Data modeling

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Proceedings Article | 4 May 2005 Paper

193nm dual layer organic BARCs for high NA immersion lithography

David Abdallah, Mark Neisser, Ralph Dammel, Georg Pawlowski, S. Ding, Francis Houlihan, Andrew Romano, J. Biafore, Alex Raub

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.600736

KEYWORDS: Fourier transforms, Reflectivity, Lithography, Etching, Bottom antireflective coatings, Multilayers, Antireflective coatings, Semiconducting wafers, Stereolithography, 193nm lithography

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Proceedings Article | 4 May 2005 Paper

Study of barrier coats for application in immersion 193-nm lithography

Francis Houlihan, Wookyu Kim, Raj Sakamuri, Keino Hamilton, Alla Dimerli, David Abdallah, Andrew Romano, Ralph Dammel, Georg Pawlowski, Alex Raub, Steve Brueck

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.601768

KEYWORDS: Thin film coatings, Lithography, Immersion lithography, Interferometry, Semiconducting wafers, Water, Refractive index, Contamination, Doping, Lithium

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Proceedings Article | 14 May 2004 Paper

Design and development of high etch rate organic bottom antireflective coating for sub-100 nm node and beyond

Hengpeng Wu, Zhong Xiang, Aritaka Hishida, David Abdallah, Jianhui Shan, Eleazar Gonzalez, Shuji Ding, Mark Neisser

Proceedings Volume 5376, (2004) https://doi.org/10.1117/12.537883

KEYWORDS: Etching, Polymers, Photoresist materials, Lithography, Fourier transforms, Semiconducting wafers, Bottom antireflective coatings, Optical lithography, Scanning electron microscopy, Refractive index

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Showing 5 of 12 publications

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