David Tumpold
at Technische Univ Wien
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Publications (1)

Proceedings Article | 17 May 2013 Paper
D. Tumpold, M. Kaltenbacher, C. Glacer, M. Nawaz, A. Dehé
Proceedings Volume 8763, 876324 (2013) https://doi.org/10.1117/12.2016468
KEYWORDS: Acoustics, Capacitance, Microelectromechanical systems, Finite element methods, Chemical elements, 3D modeling, Electrodes, CMOS technology, Scanning probe lithography, Computer simulations

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