Proceedings Article | 3 May 2016
Proc. SPIE. 9820, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVII
KEYWORDS: Staring arrays, Staring arrays, Infrared imaging, Mid-IR, Light emitting diodes, Light emitting diodes, Data modeling, Projection systems, Infrared radiation, Infrared radiation, Imaging infrared seeker, Thermal modeling, Systems modeling
Next-generation Infrared Focal Plane Arrays (IRFPAs) are demonstrating ever increasing frame rates, dynamic range,
and format size, while moving to smaller pitch arrays.1 These improvements in IRFPA performance and array format
have challenged the IRFPA test community to accurately and reliably test them in a Hardware-In-the-Loop environment
utilizing Infrared Scene Projector (IRSP) systems. The rapidly-evolving IR seeker and sensor technology has, in some
cases, surpassed the capabilities of existing IRSP technology.
To meet the demands of future IRFPA testing, Santa Barbara Infrared Inc. is developing an Infrared Light Emitting
Diode IRSP system. Design goals of the system include a peak radiance >2.0W/cm2/sr within the 3.0-5.0μm waveband,
maximum frame rates >240Hz, and >4million pixels within a form factor supported by pixel pitches ≤32μm. This paper
provides an overview of our current phase of development, system design considerations, and future development work.