Dr. Detlef Hofmann
Lithography Engineer at Infineon Technologies Dresden
SPIE Involvement:
Author
Publications (13)

Proceedings Article | 13 March 2018 Paper
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Oxides, Etching, Metals, Copper, Resistance, Capacitance, Photomasks, Critical dimension metrology, Semiconducting wafers, Chemical mechanical planarization

Proceedings Article | 13 March 2018 Paper
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Oxides, Etching, Metals, Copper, Resistance, Scatterometry, Critical dimension metrology, Semiconducting wafers, Scatter measurement, Chemical mechanical planarization

Proceedings Article | 28 March 2017 Presentation + Paper
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Metrology, Statistical analysis, Data modeling, Metals, Reliability, Distortion, Process control, Optical alignment, Virtual reality, Semiconducting wafers, Environmental sensing, Overlay metrology, Model-based design, Back end of line, Front end of line

Proceedings Article | 26 March 2015 Paper
Proc. SPIE. 9426, Optical Microlithography XXVIII
KEYWORDS: Oxides, Visualization, Etching, Metals, Silicon, Manufacturing, Computer simulations, Signal processing, Optical alignment, Semiconducting wafers

Proceedings Article | 24 March 2006 Paper
Proc. SPIE. 6152, Metrology, Inspection, and Process Control for Microlithography XX
KEYWORDS: Lithography, Metrology, Data modeling, Etching, Sputter deposition, Metals, Process control, Aluminum, Semiconducting wafers, Overlay metrology

Showing 5 of 13 publications
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