Dr. Dirk Weiler Profile

Dr. Dirk Weiler

Head of Department at Fraunhofer-IMS

SPIE Involvement:

Author

Publications (12)

Proceedings Article | 23 October 2023 Presentation + Paper

Uncooled thermal MWIR imagers for high-temperature imaging applications

M. Michel, S. Blaeser, A. Litke, E. Zakizade, S. Weyers, D. Weiler

Proceedings Volume 12737, 1273703 (2023) https://doi.org/10.1117/12.2684353

KEYWORDS: Mid-IR, Long wavelength infrared, Imaging systems, Microbolometers, Thermography, Optical transmission, Black bodies, Absorption, Silicon, Temperature metrology

Read Abstract +

Proceedings Article | 13 June 2023 Presentation + Paper

Capabilities of scaled microbolometers for uncooled thermal imaging below 10µm pixel pitch

M. Michel, S. Blaeser, A. Litke, E. Zakizade, S. Weyers, D. Weiler

Proceedings Volume 12534, 1253419 (2023) https://doi.org/10.1117/12.2663466

KEYWORDS: Microbolometers, Thermography, Nanotubes, Readout integrated circuits, Black bodies, Long wavelength infrared, Electro optics, Amorphous silicon, Thermal sensing, Optical limiting

Read Abstract +

Proceedings Article | 27 May 2022 Presentation + Paper

Scalable nanotube microbolometers for uncooled thermal imaging

Sebastian Blaeser, Marvin Michel, Elahe Zakizade, Sascha Weyers, Dirk Weiler

Proceedings Volume 12107, 1210719 (2022) https://doi.org/10.1117/12.2617406

KEYWORDS: Microbolometers, Electro optics, Absorption, Thermography, Readout integrated circuits, Sensors, Infrared radiation, Resistance, Image resolution, Long wavelength infrared

Read Abstract +

Proceedings Article | 12 September 2021 Presentation + Paper

6 µm microbolometers for uncooled thermal imaging

M. Michel, S. Blaeser, E. Zakizade, S. Weyers, D. Weiler

Proceedings Volume 11866, 1186605 (2021) https://doi.org/10.1117/12.2597969

KEYWORDS: Microbolometers, Thermography, Readout integrated circuits, Imaging systems, Body temperature, Thermal sensing, Temperature metrology, Cameras, Black bodies, Sensors

Read Abstract +

Proceedings Article | 20 September 2020 Presentation + Paper

Scalable nanotube-microbolometer technology with pixel pitches from 12 down to 6 µm

M. Michel, S. Weyers, D. Weiler, S. Blaeser, E. Zakizade, F. Hochschulz, H. Vogt

Proceedings Volume 11537, 1153704 (2020) https://doi.org/10.1117/12.2573895

KEYWORDS: Microbolometers, Nanotechnology, Readout integrated circuits, Manufacturing, Electro optics, Resistance, Nanolithography, Microsystems, Digital electronics, Black bodies

Read Abstract +

Proceedings Article | 9 October 2018 Paper

Digital uncooled IRFPAs based on microbolometers with 17 µm and 12 µm pixel pitch

Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin Michel, Andreas Kuhl, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, Holger Vogt

Proceedings Volume 10795, 1079504 (2018) https://doi.org/10.1117/12.2503423

KEYWORDS: Microbolometers, Readout integrated circuits, Sensors, Temperature metrology, Thermography, Black bodies, Infrared radiation, Semiconducting wafers

Read Abstract +

Proceedings Article | 29 May 2018 Presentation + Paper

High-performance uncooled digital 17 μm QVGA-IRFPA-using microbolometer based on amorphous silicon with massively parallel Sigma-Delta-ADC readout

Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin Michel, Daniel Würfel, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, Holger Vogt

Proceedings Volume 10624, 1062419 (2018) https://doi.org/10.1117/12.2304866

KEYWORDS: Microbolometers, Semiconducting wafers, Amorphous silicon, Temperature metrology, Readout integrated circuits, Black bodies, Sensors, Analog electronics, Antireflective coatings, Interfaces

Read Abstract +

Proceedings Article | 20 May 2016 Paper

Measurement results of a 12 µm pixel size microbolometer array based on a novel thermally isolating structure integrated on a 17 µm ROIC

K.-M. Muckensturm, D. Weiler, F. Hochschulz, C. Busch, T. Geruschke, S. Wall, J. Heß, D. Würfel, R. Lerch, H. Vogt

Proceedings Volume 9819, 98191N (2016) https://doi.org/10.1117/12.2223608

KEYWORDS: Microbolometers, Electro optics, Readout integrated circuits, Absorption, Reflectors, Resistance, Semiconducting wafers, Infrared radiation, Nanolithography, Optical resonators

Read Abstract +

Proceedings Article | 24 June 2014 Paper

Uncooled digital IRFPA-family with 17μm pixel-pitch based on amorphous silicon with massively parallel Sigma-Delta-ADC readout

D. Weiler, F. Hochschulz, D. Würfel, R. Lerch, T. Geruschke, S. Wall, J. Heß, Q. Wang, H. Vogt

Proceedings Volume 9070, 90701M (2014) https://doi.org/10.1117/12.2050445

KEYWORDS: Microbolometers, Sensors, Semiconducting wafers, Amorphous silicon, Readout integrated circuits, Thermography, Packaging, Electro optics, Bolometers, Absorption

Read Abstract +

Proceedings Article | 21 May 2011 Paper

Improvements of a digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massively parallel Sigma-Delta-ADC readout

Dirk Weiler, Marco Ruß, Daniel Würfel, Renee Lerch, Pin Yang, Jochen Bauer, Jennifer Heß, Piotr Kropelnicki, Holger Vogt

Proceedings Volume 8012, 80121F (2011) https://doi.org/10.1117/12.883791

KEYWORDS: Microbolometers, Amorphous silicon, Ceramics, Semiconducting wafers, Readout integrated circuits, Thermography, Resistance, Packaging, Electro optics, Analog electronics

Read Abstract +

Proceedings Article | 28 October 2010 Paper

Fabrication method for chip-scale-vacuum-packages based on a chip-to-wafer-process

J. Bauer, D. Weiler, M. Ruß, J. Heß, P. Yang, J. Voß, N, Arnold, H. Vogt

Proceedings Volume 7834, 78340S (2010) https://doi.org/10.1117/12.865019

KEYWORDS: Semiconducting wafers, Tin, Bolometers, Infrared bolometers, Infrared radiation, Packaging, Reflectivity, Wafer bonding, Sensors, Plating

Read Abstract +

Proceedings Article | 4 May 2010 Paper

A digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massive parallel Sigma-Delta-ADC readout

Dirk Weiler, Marco Russ, Daniel Würfel, Renee Lerch, Pin Yang, Jochen Bauer, Holger Vogt

Proceedings Volume 7660, 76600S (2010) https://doi.org/10.1117/12.849839

KEYWORDS: Microbolometers, Amorphous silicon, Thermography, Semiconducting wafers, Bolometers, Modulators, Electro optics, Packaging, Antireflective coatings, Analog electronics

Read Abstract +

Showing 5 of 12 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years