Dr. Edward W. Reutzel Profile

Dr. Edward W. Reutzel

Head of LPT Dept at Applied Research Lab

SPIE Involvement:

Author | Editor

Proceedings Article | 24 April 2020 Presentation

Laser ultrasonic testing of titanium alloy parts inside the directed energy deposition additive manufacturing chamber (Conference Presentation)

Chaitanya Bakre, Gerald Boddie, Cory Jamieson, Abdalla Nassar, Edward Reutzel, Cliff Lissenden

Proceedings Volume 11381, 1138105 (2020) https://doi.org/10.1117/12.2559129

KEYWORDS: Ultrasonics, Additive manufacturing, Directed energy weapons, Titanium, Nondestructive evaluation, Surface roughness, Metals, Q switched lasers, Nd:YAG lasers, Interferometers

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Proceedings Article | 6 April 2016 Paper

Sensing for directed energy deposition and powder bed fusion additive manufacturing at Penn State University

Abdalla Nassar, Edward Reutzel, Stephen Brown, John Morgan, Jacob Morgan, Donald Natale, Rick Tutwiler, David Feck, Jeffery Banks

Proceedings Volume 9738, 97380R (2016) https://doi.org/10.1117/12.2217855

KEYWORDS: Imaging systems, Pyrometry, Image processing, Additive manufacturing, Sensing systems, Cameras, Temperature metrology, Directed energy weapons, Laser optics, Calibration

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Proceedings Article | 14 May 2015 Paper

A brief survey of sensing for metal-based powder bed fusion additive manufacturing

Bryant Foster, Edward Reutzel, Abdalla Nassar, Corey Dickman, Benjamin Hall

Proceedings Volume 9489, 94890B (2015) https://doi.org/10.1117/12.2180654

KEYWORDS: Additive manufacturing, Metals, Control systems, Image processing, Sensors, Cameras, Laser systems engineering, 3D modeling, Infrared cameras, Process control

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Purpose – Powder bed fusion additive manufacturing (PBFAM) of metal components has attracted much attention, but the inability to quickly and easily ensure quality has limited its industrial use. Since the technology is currently being investigated for critical engineered components and is largely considered unsuitable for high volume production, traditional statistical quality control methods cannot be readily applied. An alternative strategy for quality control is to monitor the build in real time with a variety of sensing methods and, when possible, to correct any defects as they occur. This article reviews the cause of common defects in powder bed additive manufacturing, briefly surveys process monitoring strategies in the literature, and summarizes recently-developed strategies to monitor part quality during the build process.

Design/methodology/approach – Factors that affect part quality in powder bed additive manufacturing are categorized as those influenced by machine variables and those affected by other build attributes. Within each category, multiple process monitoring methods are presented.

Findings – A multitude of factors contribute to the overall quality of a part built using PBFAM. Rather than limiting processing to a pre-defined build recipe and assuming complete repeatability, part quality will be ensured by monitoring the process as it occurs and, when possible, altering the process conditions or build plan in real-time. Recent work shows promise in this area and brings us closer to the goal of wide-spread adoption of additive manufacturing technology.

Originality/value - This work serves to introduce and define the possible sources of defects and errors in metal-based PBFAM, and surveys sensing and control methods which have recently been investigated to increase overall part quality. Emphasis has been placed on novel developments in the field and their contribution to the understanding of the additive manufacturing process.

Proceedings Article | 16 September 2013 Paper

Role of processing parameters on morphology, resistance and composition of laser fired contacts

A. Raghavan, T. Palmer, A. Domask, S. Mohney, E. Reutzel, T. DebRoy

Proceedings Volume 8826, 882606 (2013) https://doi.org/10.1117/12.2023978

KEYWORDS: Resistance, Aluminum, Silicon, Pulsed laser operation, Laser processing, Semiconducting wafers, Semiconductor lasers, Solar cells, Fiber lasers, Silica

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Proceedings Article | 15 October 2012 Paper

Laser-doped selective emitters for photovoltaic applications

J. Woolridge, E. Reutzel, S. Ashok, L. Zou

Proceedings Volume 8549, 85493H (2012) https://doi.org/10.1117/12.927446

KEYWORDS: Diodes, Resistance, Silicon, Doping, Laser processing, Pulsed laser operation, Semiconducting wafers, Diagnostics, Aluminum

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Proceedings Article | 12 October 2012 Paper

Parameter optimization of laser-doped selective emitters for applications in silicon solar cells

Holly Heinrichs, Edward Reutzel, S. Ashok, Suzanne Mohney

Proceedings Volume 8473, 84730W (2012) https://doi.org/10.1117/12.929369

KEYWORDS: Pulsed laser operation, Resistance, Semiconductor lasers, Diodes, Continuous wave operation, Laser processing, Semiconducting wafers, Metals, Q switched lasers, Silicon

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Proceedings Article | 12 October 2012 Paper

Modeling of contact geometry and dopant profile during laser-silicon interaction

A. Raghavan, J. J. Blecher, T. A. Palmer, E. W. Reutzel, T. DebRoy

Proceedings Volume 8473, 847304 (2012) https://doi.org/10.1117/12.933861

KEYWORDS: Aluminum, Silicon, Laser processing, Resistance, Convection, Semiconductor lasers, Doping, Mathematical modeling, Phosphorus, Pulsed laser operation

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