Prof. Enakshi Bhattacharya
Professor at IIT Madras
SPIE Involvement:
Author
Publications (14)

Proceedings Article | 18 February 2010 Paper
Proc. SPIE. 7594, MOEMS and Miniaturized Systems IX
KEYWORDS: Microelectromechanical systems, Oxides, Mirrors, Interferometers, Spectroscopy, Fourier transforms, Micromirrors, Photomasks, Semiconducting wafers, Wafer bonding

Proceedings Article | 5 February 2010 Paper
Proc. SPIE. 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
KEYWORDS: Microelectromechanical systems, Sensors, Etching, Composites, Silicon, Coating, Reliability, Picosecond phenomena, Self-assembled monolayers, Electrochemical etching

Proceedings Article | 5 February 2010 Paper
Proc. SPIE. 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
KEYWORDS: Packaging, Gold, Oxides, Sensors, Glasses, Dielectrics, Silicon, Biosensors, Semiconducting wafers, Adhesives

SPIE Journal Paper | 1 July 2009
JM3 Vol. 8 Issue 03
KEYWORDS: Resistors, Resistance, Oxides, Etching, Surface micromachining, Thin films, Reactive ion etching, Microelectronics, Wet etching, Profilometers

SPIE Journal Paper | 1 July 2009
JM3 Vol. 8 Issue 03
KEYWORDS: Composites, Sensors, Picosecond phenomena, Silicon, Humidity, Crystals, Semiconducting wafers, Microelectromechanical systems, Scanning electron microscopy, Metals

Showing 5 of 14 publications
Conference Committee Involvement (6)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
24 January 2011 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
25 January 2010 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
28 January 2009 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
21 January 2008 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
23 January 2007 | San Jose, California, United States
Showing 5 of 6 Conference Committees
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