While EUV systems equipped with a 0.33 Numerical Aperture (NA) lens are readying to start high volume manufacturing, ASML and Zeiss are in parallel ramping up their activities on an EUV exposure tool with an NA of 0.55.
The purpose of this high-NA scanner, targeting an ultimate resolution of 8nm, is to extend Moore’s law throughout the next decade.
A novel lens design, capable of providing the required Numerical Aperture, has been identified; this lens will be paired with new, faster stages and more accurate sensors enabling the tight focus and overlay control needed for future process nodes.
In this paper an update will be given on the status of the developments at Carl Zeiss and ASML. Next to this, we will address several topics inherent in the new design and smaller target resolution: M3D effects, polarization, focus control and stitching.
The optical train is a key sub-system of each lithography scanner. The single patterning resolution limit of a scanner is determined by the characteristics and performance of its imaging system consisting of illumination and projection optics. The most relevant performance parameters of the illumination system are the maximum achievable setting flexibility, off-axis imaging capability (sigma) and pupil fill ratio (PFR). The projection optics key drivers numerical aperture (NA), aberration level, and stray light determine resolution limit and image quality of the scanner. In EUV lithography, optimizing aerial image contrast and image overlay is of particular importance to achieve the required resolution and edge placement performance of the scanner because stochastic effects degrading the initial image as e.g. resist blur and photon shot noise are still comparably strong.
In this paper, we present an overview on the new features of the NXE:3400 EUV optical system designed to improve resolution limit, contrast and overlay performance of the NXE:3400 scanner. The illumination system features a novel design based on a large number of switchable facetted mirrors which enables an unprecedented setting flexibility and reduced pupil fill ratio. Furthermore, the off-axis imaging capability of the illuminator has been extended to the full NA which in combination with the reduced PFR improves the single patterning resolution limit of the NXE:3400 by approximately 20% down to 13nm. In addition, by exploiting the increased flexibility of the 3400 illumination system, we demonstrate the ability to further correct for 3D mask effects, and excellent matching to the NXE:3350 system. The projection optics features a NA of 0.33 with significantly reduced aberration level as compared to the precedent 3350 projection optics. In particular, the non-correctable errors impacting scanner overlay, and the wavefront RMS impacting image contrast have been substantially reduced. Keeping the design concept, the improvements have been implemented such that a seamless matching to the 3350 projection optics is guaranteed.
Finally, we present NXE:3400 printing results to verify the imaging performance of the NXE:3400 optical system in resist. NXE:3400B wafer prints demonstrate excellent and consistent imaging performance across several systems in line with the discussed improvements of the optical train.
While EUV systems equipped with a 0.33 Numerical Aperture lenses are readying to start volume manufacturing, ASML and Zeiss are ramping up their activities on a EUV exposure tool with Numerical Aperture of 0.55.
The purpose of this scanner, targeting an ultimate resolution of 8nm, is to extend Moore’s law throughout the next decade.
A novel, anamorphic lens design, capable of providing the required Numerical Aperture has been investigated; This lens will be paired with new, faster stages and more accurate sensors enabling Moore’s law economical requirements, as well as the tight focus and overlay control needed for future process nodes.
The tighter focus and overlay control budgets, as well as the anamorphic optics, will drive innovations in the imaging and OPC modelling.
Furthermore, advances in resist and mask technology will be required to image lithography features with less than 10nm resolution.
This paper presents an overview of the target specifications, key technology innovations and imaging simulations demonstrating the advantages as compared to 0.33NA and showing the capabilities of the next generation EUV systems.
While EUV systems equipped with a 0.33 Numerical Aperture lenses are readying to start volume manufacturing, ASML and Zeiss are ramping up their development activities on a EUV exposure tool with Numerical Aperture greater than 0.5. The purpose of this scanner, targeting a resolution of 8nm, is to extend Moore’s law throughout the next decade.
A novel, anamorphic lens design, has been developed to provide the required Numerical Aperture; this lens will be paired with new, faster stages and more accurate sensors enabling Moore’s law economical requirements, as well as the tight focus and overlay control needed for future process nodes.
The tighter focus and overlay control budgets, as well as the anamorphic optics, will drive innovations in the imaging and OPC modelling, and possibly in the metrology concepts.
Furthermore, advances in resist and mask technology will be required to image lithography features with less than 10nm resolution.
This paper presents an overview of the key technology innovations and infrastructure requirements for the next generation EUV systems.
With the 1st NXE:3100 being operational at a Semiconductor Manufacturer and a 2nd system being shipped at the time of
writing this paper, we enter the next phase in the implementation of EUV Lithography. Since 2006 process and early
device verification has been done using the two Alpha Demo Tools (ADT's) located at IMEC in Leuven, Belgium and at
the CSNE in Albany, New York, USA. Now process integration has started at actual Chipmakers sites. This is a major
step for the development and implementation of EUVL. The focus is now on the integration of exposure tools into a
manufacturing flow, preparing high volume manufacturing expected to start in 2013.
While last year's NXE:3100 paper focused on module performance including optics, leveling and stages, this years
update will, in detail, assess imaging, overlay and productivity performance. Based on data obtained during the
integration phase of the NXE:3100 we will assess the readiness of the system for process integration at 27nm hp and
below. Imaging performance with both conventional and off-axis illumination will be evaluated. Although single
exposure processes offer some relief, overlay requirements continue to be challenging for exposure tools. We will share
the status of the overlay performance of the NXE:3100. Source power is a key element in reaching the productivity of
the NXE:3100 - its status will be discussed as well.
Looking forward to high volume manufacturing with EUV we will update on the design status of the NXE:3300B being
introduced in 2012 with a productivity target of 125wph. Featuring a 0.33NA lens and off-axis illumination at full
transmission, a half pitch resolution from 22nm to 16nm can be supported. In order to ensure a solid volume ramp-up the
NXE:3300B will be built on as many building blocks from the NXE:3100 as possible making optimum use of the NXE
platform concept.
ASML's recently announced TWINSCAN$TM) lithography platform is specifically designed to meet the specific needs of handling and processing 300 mm substrates. This new platform, already supporting a family of Step & Scan lithography systems for I-line and 248 nm DUV, is designed to further support optical lithography at its limits with systems for 193 nm and 157 nm. The conflicting requirements associated with higher productivity on one side, and more extensive metrology on the other, have led to the development of a platform with two independent wafer stages operating in parallel. The hardware associated with exposure, and the hardware and sub-systems required for metrology, are located in two separate positions. While a wafer is exposed on one stage, wafer unload/load and measurements of the horizontal and vertical wafer maps are done in parallel on the second stage. After the two processes are completed, where the exposure sequence typically is the longest, the two stages are swapped. The process is continued on the second stage, while the first stage unloads the exposed wafer and starts the process again.
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