We have investigated the influence of carbon concentration on the low frequency noise (LFN) of Si/SiGe:C
Heterojunction Bipolar Transistors (HBTs). The HBTs are supplied by ST-Microelectronics Crolles and are based on a
0.13 &mgr;m BiCMOS technology. Three types of transistors were studied; they only differ by the amount of carbon
incorporated. When carbon is incorporated, representative noise spectra of the input current spectral density, SiB, show
important generation-recombination (G-R) components, while no such components are observed in carbon free
transistors. When the 1/f noise component is unambiguously observed, the associated figure of merit KB has a very good
value close to 4.10-10 &mgr;m2. In this paper we focus on the analysis of the G-R components associated with the presence of the carbon. Most of the observed Lorentzians are associated with Random Telegraph Signal (RTS) noise. No RTS noise
is found in carbon free devices. The RTS noise appears to be due to electrically active defects formed by the addition of
carbon, typically observed for concentrations above the bulk solid solubility limit in silicon. The RTS noise, amplitude
&Dgr;IB and the mean pulse widths (tH, tL), are analyzed as a function of bias voltage and temperature. The RTS amplitude is
found to scale with the base current and to decrease exponentially with temperature, independently of the carbon
concentration. The mean pulse widths are found to decrease rapidly with bias voltage, as 1/exp(qVBE/kT) or stronger. Our results confirm that electrically active C-related defects are localized in the base-emitter junction, and the RTS amplitude is explained by a model based on voltage barrier height fluctuations across the base-emitter junction induced by trapped
carriers in the space charge region. The observed bias dependence of mean pulse widths seems to indicate that two
capture processes are involved, electron and hole capture. These C-related defects behave like recombination centers
with deep energy levels rather than electron or hole traps involving trapping-detrapping process.
This work presents low frequency noise results in high-speed Si/SiGeC heterojunction bipolar transistors (HBTs). In this new generation of HBTs carbon doping is processed during of the deposit of the epitaxial SiGe base layer in order to suppress boron out-diffusion. Low frequency noise study is performed on three type of transistors that differ by the thickness of the Si cap layer. The Si Cap layer is a non intentional doped Si layer deposit after the SiGeC base layer and prior the contact emitter structure. Thus, the results on the three different Si Cap HBTs allow us to study the influence of the Emitter-Base junction depth on the low frequency noise of these HBTs. Measurements of the equivalent input noise spectral density (SiB) showed that spectra are composed of a 1/f component and the white noise is always reached at low bias. For the smallest transistors we observed the presence of Lorentzian(s) component(s). The excess noise sources are mainly located at the intrinsic emitter-base junction. Concerning the 1/f noise level, a quadratic dependence on base current bias and an inverse dependence on the emitter area are found. The normalized figure of merit, Kb = KfxAE, is ranging between 1.7 and 2.1 10-9 μm2 and is among the best results published concerning SiGe HBTs, this shows that the incorporation of carbon do not have any consequence for the 1/f noise level and more generally for the LF noise characteristics. In the Si Cap thickness range used in this work, no noise degradation is observed when the electrical emitter-base junction is getting closer to the poly/mono emitter interface. Hence DC and AC characteristics could be optimized without changing the LF noise performances. Finally, from measurements at the input and at the output, the emitter series resistance is extracted and is found to be proportional to the Si Cap thickness.
The I-V characteristics of GaN/AlGaN HFET and 1/f noise at 4K have been measured in strong magnetic fields, where the electron mobility is affected by geometric magnetoresistance. The magnetic field dependence of the 1/f noise shows that the number of electrons fluctuations is the dominant mechanism of the 1/f noise and precludes the mobility fluctuations mechanism. The channel mobility extracted from the magnetoresistance data first increases with gate bias reaching the maximum value of ~(0.9-1.0) m2/Vs at the 2D electron concentration of 5x1012 cm-2. This maximum value is close to the estimated ballistic mobility limit of 1.2 m2/Vs determined by the electron transit time with the Fermi velocity.
The low frequency noise characteristics of double self-aligned InP/InGaAs and two types Si/SiGe heterojunction bipolar transistors (HBTs) were investigated. Spectral analysis shows no striking differences; the spectra are composed of a 1/f component and the white noise is always reached at low bias. A general trend for all the transistors was the presence of Lorentzian(s) component(s) for the smallest devices. The voltage coherence function was always one for SiGe transistors; and for the first time, it was found to be close to zero for InP devices. Concerning the 1/f noise level, both types of transistors have approximately a quadratic dependence on base current bias and an inverse dependence on the emitter area. Thus a comparison of the 1/f noise level has been made using the Kb parameter, and values around 109 μm2 for SiGe HBTs and around 108 μm2 for InP HBTs were found. These results are of same order of magnitude as the best published ones. The low frequency noise results suggest that excess noise sources are mainly located at the intrinsic emitter-base junction for the two type of SiGe devices, and for the for InP HBTs, a correlated noise source is located at the emitter periphery. To compare different devices and technologies, fc/fT where fT is the unity current gain frequency was studied as a function of collector current density and for some HBT technologies, fc/fT α Jc. The effects of different processing conditions, designs and temperature were also investigated and will be discussed.
For many analog integrated circuit applications, the polysilicon emitter bipolar junction transistor (PE-BJT) is still the preferred choice because of its higher operational frequency and lower noise performance characteristics compared to MOS transistors of similar active areas and at similar biasing currents. In this paper, we begin by motivating the reader with reasons why bipolar transistors are still of great interest for analog integrated circuits. This motivation includes a comparison between BJT and the MOSFET using a simple small-signal equivalent circuit to derive important parameters that can be used to compare these two technologies. An extensive review of the popular theories used to explain low frequency noise results is presented. However, in almost all instances, these theories have not been fully tested. The effects of different processing technologies and conditions on the noise performance of PE-BJTs is reviewed and a summary of some of the key technological steps and device parameters and their effects on noise is discussed. The effects of temperature and emitter geometries scaling is reviewed. It is shown that dispersion of the low frequency noise in ultra-small geometries is a serious issue since the rate of increase of the noise dispersion is faster than the noise itself as the emitter geometry is scaled to smaller values. Finally, some ideas for future research on PE-BJTs, some of which are also applicable to SiGe heteorjunction bipolar transistors and MOSFETs, are presented after the conclusions.
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