Applications of the Voltage ImagingTM technique in testing active arrays used in AMLCDs have been widely discussed. Voltage ImagingTM is well known for its simplicity in interfacing with active array panels, and its superior voltage measurement accuracy and repeatability. It is also known for having broad test applicability for many AMLCD panel design technologies, such as TFT, MIM, diode and panels with integrated drivers. This paper briefly discusses a recent improvement related to the application of Voltage ImagingTM for L-contact panel testing. As the panel manufacturers are trying to reduce the manufacturing cost, the number of panels on one substrate also increases which, in several cases, leaves only enough room to add ESD protection shorting rings on two of the four sides of a panel. Since this is the trend of the industry, a methodology that can be employed to test L-contact panels with Voltage ImagingTM is presented in this paper.
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