Mr. Frank Meyer Profile

Frank Meyer

at Laser Zentrum Hannover eV

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Proceedings Article | 17 October 2003 Paper

Laser-based manufacturing of high-accuracy electrodes into brittle materials

Christian Kulik, Andreas Ostendorf, Frank Meyer

Proceedings Volume 4977, (2003) https://doi.org/10.1117/12.479535

KEYWORDS: Sensors, Electrodes, Manufacturing, Dielectrics, Excimer lasers, Laser ablation, Laser manufacturing, Ceramics, Glasses, Electroplating

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Dielectric sensors with smallest electrode structures are used to monitor several technical applications. Thus, durable substrate materials are essential for the exploitation of the sensors in hostile process environment. Here, ceramics and different glasses show ideal material properties, but are difficult-to-machine in the micrometer range. UV-laser beam sources are well suited for an economic manufacturing of micro-structures in these brittle materials. Especially, advanced laser tools like excimer- and frequency converted solid-state lasers show excellent machining results. This paper presents the development of new laser based production techniques and innovative process chains for the fabrication of distinctive electrode structures in high stable materials. Two different machining concepts are shown. A conductive Indium Tin-Oxide (ITO) layer with a thickness of about 600nm has been structured with a KrF excimer laser (λ = 248 nm, H = 5 J/cm²), without damaging the underlying borosilicate glass substrate. The dimension of the electrodes and insulation channels of the sensor are as small as 50μm. For the second approach of manufacturing a dielectric sensor, aluminum oxide as a bulk substrate materials has been machined with the same laser type. No thermal damage was observed by an operating fluence H = 20 J/cm². The obtained extreme durable embedded-electrode-type sensor can completed by filling the cavity with conductive material by standard electroplating techniques. For the manufacturing process, a high flexible NC-controlled machining concept is presented, which allows a time and pulse minimized fabrication as well as an optimization of the surface quality of the micro-sensor, including a process optimization via simulation.

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