Mr. Gary J. Pangelina Profile

Gary J. Pangelina

at Centrotherm Thermal Solutions

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Proceedings Article | 16 January 2003 Paper

MEMS production and yield improvement using a flux-free/void-free assembly process

Gary Pangelina

Proceedings Volume 4980, (2003) https://doi.org/10.1117/12.478205

KEYWORDS: Microelectromechanical systems, Reliability, Gold, Microelectronics, Yield improvement, Oxides, Chemical elements, Metals, Electronics, Silicon

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Microelectromechanical systems (MEMS) promise to revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology, thereby, making possible the realization of a complete system on a chip. As the MEMS application approaches the different market places cost, performance, hermeticity, and reliability become the key issues. Flux free/void-free soldering is accomplished by controlling the atmosphere, time, and temperature. This is a simplified version of the Pressure Variation method. P1 V1 = P2 V2, V2 = V1 (P1/ P2). The hermeticity level of the package can directly affect MEMS device performance. Hermeticity level of 10^-8and sometimes 10⁹ are common measurements. Getter firing as part of the package seal process means higher yields, total control of the internal atmosphere of the package, improved quality and reliability. Getter pumps are based on those elements in the periodic table with features that make them suitable to act as a vacuum pump. Quality control standards for MEMS technologies are needed. Part of the problem is that the technology is so new and ever changing that the fabricators do not yet know how to define quality, much less measure it.

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