The extreme sensitivity of quantum magnetometers enables new applications in material testing such as the identification of single defect events in the bulk of small volume specimen (0.1 mm³). Exposing ferromagnetic materials to strain alters their magnetic response. Due to uncompensated spins, defects arising from the fatigue process interact with magnetic domain walls. Optically pumped zero-field magnetometers (OPM) provide the sensitivity required to measure small variations in the magnetic response and potentially to quantify damage in the material. We provide first results of a novel micro fatigue setup with an integrated OPM to correlate variations of the magnetic response in a multimodal approach. The position of the Villari reversals within the magneto-mechanic hysteresis and the amplitude of magnetic field are potential candidates to estimate fatigue damage within the specimen.
Materials with magnetic shape memory (MSM) are promising candidates for application in next generation devices, such as actuators and switching valves. They exhibit elongation and contraction in a magnetic field and allow to achieve fast switching times in the order of milliseconds while maintaining high positioning precision over millions of cycles. Studying and developing applications using these materials creates a need for fast and accurate methods for analyzing their shape and deformations. We present a technology that utilizes capabilities of two interferometric methods - digital holography (DH) and electronic speckle pattern interferometry (ESPI). While digital holography enables high-precision 3D measurement of the object surface, electronic speckle pattern interferometry provides data on high-frequency deformations with nanometer accuracy. Combining both techniques allows to obtain comprehensive information about the morphology and dynamics of samples.
The electronics industry is creating complex miniaturized devices with steadily higher power density. The increase of maximum operating temperatures affects the thermo-mechanical load and imposes greater requirements on the quality of electronic packages. Fast and reliable methods for inspecting the quality of electronic components can help to improve production quality and to reduce waste and environmental burden. We present a compact optical sensor based on Electronic Speckle Pattern Interferometry (ESPI) that provides a possibility to carry out such control in a fast, precise and non-contact manner and can be integrated directly in a production line. Analysing thermo-mechanical deformations of objects under study, the system is capable of identifying common defects in electronic modules, such as die attachment delamination.
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