Dr. Giovan Battista Preve Profile

Dr. Giovan Battista Preve

at INPHOTEC

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Publications (5)

Proceedings Article | 11 June 2021 Open Access

The ESA project PIOTS: setting up a complete pilot line for the packaging of photonic integrated circuits for space applications

D. Rotta, G. B. Preve, A. Serrano Rodrigo, M. Chiesa, G. Cucinella, A. Bogoni

Proceedings Volume 11852, 118525G (2021) https://doi.org/10.1117/12.2599959

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Photonic Integrated Circuits (PICs) are expected to have a primary role for space applications in the years to come. The growing interest for the PICs for space applications lays in the fact the integrated photonics brings notable advantages as, among others: 1) Size, Weight and Power (SWaP) reduction 2) Removal/reduction of electromagnetic interferences 3) More flexibility (e.g. Network-on-chip) 4) Convergence with integrated electronics with potential costs reduction and improved performance (e.g. Beamforming) 5) Possibility to avoid optical to electronic to optical conversions (O-E-O) by maintaining some functions at photonic level in the optical domain, like for example in optical beamforming and photonics-based up- and down-conversion However, photonic packaging is less mature than its microelectronic counterpart. In fact, considering the great advancements in designing and fabricating integrated photonic chips, photonic packaging still represents a limiting factor and requires dedicated effort especially in view of a full exploitation of integrated photonics for Space applications. There is necessity to develop the proper packaging technologies compatible with the Space requirements as well the proper packaging line processes controls and documentations. PIOTS project aims to answer such demand by creating an end-to-end packaging pilot line that is strategically oriented to the demands of ESA and European space industry. This goal will be demonstrated through the realization of two test vehicles and the validation of manufacturing processes, equipment and techniques by means of an adequate Quality System implementation, including documentation and in-line controls as required to manufacture a product complying with requirements of the space sector. The paper will update on the project status focusing on the two test vehicles: TV1 - a hermetically packaged laser integrated with a SOI device TV2- a hermetically packaged SOI device with 8 in/out pigtailed fibers.

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Proceedings Article | 11 June 2021 Open Access

The H2020-SPACE-ORIONAS project: “Lasercom-on-chip” for high-speed satellite constellation interconnectivity

Leontios Stampoulidis, A. Osman, I. Sourikopoulos, G. Winzer, L. Zimmermann, Anaëlle Maho, M. Faugeron, M. Sotom, F. Caccavale, A. Serrano Rodrigo, M. Chiesa, D. Rotta, G. B. Preve, J. Edmunds, M. Welch, E. Kehayas, W. Dorward, F. Duport, R. Costa, D. Mesquita, L. Stampoulidis

Proceedings Volume 11852, 118521L (2021) https://doi.org/10.1117/12.2599248

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Proceedings Article | 4 March 2019 Presentation + Paper

Problems, challenges, and a critical survey on automated silicon photonics packaging and optical interconnection

Giovan Battista Preve

Proceedings Volume 10924, 1092415 (2019) https://doi.org/10.1117/12.2513593

KEYWORDS: Integrated optical circuits, Packaging equipment, Fiber alignment equipment, Optical benches, Photonic integrated circuits, Silicon photonics, Semiconducting wafers, Optical interconnects, Connectors, Packaging, Lenses, Waveguides

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Proceedings Article | 23 May 2018 Presentation

Automatic alignment of photonic components of massive optical switch to ITU channels (Conference Presentation)

Astghik Chalyan, Stefano Tondini, Giorgio Fontana, Lorenzo Pavesi, Nikola Zecevic, Michael Hofbauer, Bernhard Goll, Horst Zimmermann, Francesco Testa, Stefano Stracca, Alberto Bianchi, Costanza Manganelli, Philippe Velha, Paolo Pintus, Claudio Oton, Christophe Kopp, Laetitia Adelmini, Olivier Lemonnier, Gabriel Pares, Guido Chiaretti, Aina Serrano, Jose Ángel Ayucar, Giovani Battista Preve, Jong Moo Lee, Claudio Castellan

Proceedings Volume 10686, 1068613 (2018) https://doi.org/10.1117/12.2306433

KEYWORDS: Optical switching, Switching, Automatic alignment, Integrated optics, Photonic integrated circuits, Channel projecting optics, Germanium, Optical components, Control systems, Photodiodes

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We demonstrate the automatic thermal alignment of photonic components within an integrated optical switch. The WDM optical switch involves switching elements, wavelength de-multiplexers, interleavers and monitors each one needing independent control. Our system manages rerouting of channels coming from four different directions, each carrying 12, 200GHz spaced, wavelengths into eight add/drop ports. The integrated device includes 12 interleavers, which can act either as optical de-interleavers to split the optical signal into odd and even channels or as optical interleavers that recombine the odd and even channels coming from the switching matrix. Integrated Ge photodiodes are placed in key positions within the photonic integrated circuit (PIC) are serve for monitoring. An electronic integrated circuit (EIC) drives the photonic elements by means of dedicated heating circuits (824 on-board heater control cells, 768 for the switching elements and 56 for the interleavers and the mux/de-mux) and reads out the Ge diodes photocurrent through TIAs. We applied a stochastic optimization algorithm to align the spectral response of the interleavers to the ITU grid. We exploit the thermo-optic effect to shift the interleavers pass-band in a desired spectral position. The interleavers are provided with dedicated metallic heaters that can be operated in order to tune the interleaver response, which is typically misaligned due to fabrication inaccuracies. The experimental setup is made of a tunable laser coupled with one input port of optical switch. The optimization algorithm is implemented via a software to drive the EIC till finding the best heating configuration (on the two branches of the interleaver) on the basis of the monitor diode-feedback. This way, the even and odd wavelengths input in the interleaver are directed toward the wanted lines within the switching matrix. Our method has been used for aligning the micro-ring based switching elements in the PIC as well. In that case, the integrated Ge photodiodes have been used to align the photonic components in the PIC in order to enable different pathways for the routing or the broadcasting operation of the optical switch. With no bias applied to the heaters of the switching elements, the optical signal is expected to be maximum at the through port. When the micro-ring heaters are biased, the feedback controller finds the best set of heating values that minimize the optical power at the through port of the switching node. This way, the optical signal is coupled in the drop port and the node is enabled for switching. The algorithm, implemented in LabVIEW, converges over multiple instances and it is robust against stagnation. This work aims at enabling the automatic reconfiguration/restoration of the whole WDW optical switch.

Proceedings Article | 30 January 2018 Paper

High-bandwidth density optically interconnected terabit/s boards

Marco Romagnoli, Gabriele De Angelis, Luigi Tallone, Vito Sorianello, Stefano Tirelli, Bradley Snyder, Peter De Heyn, Yoojin Ban, Lieve Bogaerts, Peter Verheyen, Andy Miller, Joris Van Campenhout, Marianna Pantouvaki, Philippe Absil, Johan Bauwelinck, Xin Yin, Dries Van Thourhout, Joan Juvert Sandez, Roberto Osellame, Rebeca Martínez Vázquez, Diogo Lopes, Giovanni Battista Preve, Aina Serrano Rodrigo, Paola Galli, Guido Chiaretti, Francesco Testa, Alberto Bianchi, Ana Belen Gonzalez

Proceedings Volume 10560, 105600E (2018) https://doi.org/10.1117/12.2295897

KEYWORDS: Waveguides, Photonic integrated circuits, Semiconducting wafers, Silica, Interfaces, Modulators, Silicon, Switches, Light sources, Connectors

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