Mr. Hiroaki Kasai Profile

Hiroaki Kasai

at Hitachi High-Tetech Corporation

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Publications (1)

Proceedings Article | 10 April 2024 Presentation + Paper

Cu pad surface height evaluation technique by in-line SEM for wafer hybrid bonding

Hiroaki Kasai, Mayuka Osaki, Kazuhisa Hasumi, Nobuyuki Mise, Maki Tanaka, Bensu Tunca Altintas, Soon Aik Chew, Janusz Bogdanowicz, Alain Moussa, Mohamed Saib, Boyao Zhang, Anne-Laure Charley

Proceedings Volume 12955, 129551N (2024) https://doi.org/10.1117/12.3008658

KEYWORDS: Copper, Semiconducting wafers, Scanning electron microscopy, Wafer bonding, Sensors, Atomic force microscopy, Signal detection, Image sensors, Chemical mechanical planarization, Target detection

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