Mr. Heiko Weichert Profile

Heiko Weichert

at Tokyo Electron Europe Ltd

SPIE Involvement:

Author

Publications (5)

Proceedings Article | 1 April 2009 Paper

CDU improvement with wafer warpage control oven for high-volume manufacturing

T. Tomita, H. Weichert, S. Hornig, S. Trepte, H. Shite, R. Uemura, J. Kitano

Proceedings Volume 7273, 72734C (2009) https://doi.org/10.1117/12.814174

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Control systems, Immersion lithography, Manufacturing, High volume manufacturing, Process control, Polymers, Lithography

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Proceedings Article | 18 March 2009 Paper

Investigation of EUV-process sensitivities for wafer-track processing

Neil Bradon, Heiko Weichert, K. Nafus, S. Hatakeyama, J. Kitano, H. Kosugi, K. Yoshihara, M. Goethals, J. Hermans

Proceedings Volume 7271, 727148 (2009) https://doi.org/10.1117/12.814189

KEYWORDS: Semiconducting wafers, Extreme ultraviolet, Extreme ultraviolet lithography, Photoresist processing, Critical dimension metrology, Finite element methods, Double patterning technology, Image processing, Standards development, Lithography

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Proceedings Article | 5 April 2007 Paper

Effect and procedures of post exposure bake temperature optimization on the CD uniformity in a mass production environment

Kirsten Ruck, Heiko Weichert, Steffen Hornig, Frank Finger, Göran Fleischer, Dave Hetzer

Proceedings Volume 6518, 651850 (2007) https://doi.org/10.1117/12.712145

KEYWORDS: Semiconducting wafers, Silicon, Calibration, Scatterometry, Metrology, Wafer testing, Scatter measurement, Critical dimension metrology, Optical lithography, Integration

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Proceedings Article | 23 March 2007 Paper

Initial process evaluation for next generation immersion technology node

Tadatoshi Tomita, Kathleen Nafus, Shinichi Hatakeyama, Hitoshi Kosugi, Masashi Enomoto, Shin Inoue, Kirsten Ruck, Heiko Weichert, Mireia Blanco Mantecon, Raf Stegen, Casper de Groot, Richard Moerman

Proceedings Volume 6519, 65192B (2007) https://doi.org/10.1117/12.712206

KEYWORDS: Semiconducting wafers, Bridges, Molecular bridges, Diffractive optical elements, Manufacturing, Metrology, Image processing, Particles, Optical lithography, Scanners

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Proceedings Article | 15 March 2006 Paper

Application of integrated scatterometry measurements for a wafer-level litho feedback loop in a high-volume 300 mm DRAM production environment

Uwe Kramer, Goeran Fleischer, Thomas Marschner, Steffen Hornig, Heiko Weichert, Dave Hetzer

Proceedings Volume 6155, 615509 (2006) https://doi.org/10.1117/12.682683

KEYWORDS: Semiconducting wafers, Scatterometry, Metrology, Lithography, 3D modeling, Scatter measurement, Critical dimension metrology, Process control, Process modeling, Data processing

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